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A rotating target and binding technology, which is applied in the target field, can solve the problems of poor quality and high production cost of the rotating target, and achieve the effects of avoiding cracking and falling of the target, low cost and simple operation
Inactive Publication Date: 2020-02-28
张俊杰
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Problems solved by technology
[0008] For this reason, the embodiment of the present invention provides a rotating target cold binding process to solve the defects of poor quality and high production cost of the rotating target produced by the existing method
Method used
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Embodiment 1
[0026] A rotating target cold binding process in this embodiment includes the following steps:
[0027] 1) Prepare a silicon tube (length 1800mm) and matching 304 stainless steel tube, put the silicon tube on the 304 stainless steel tube, the unilateral gap between the inner surface of the silicon tube and the outer surface of the 304 stainless steel tube is 1.2mm;
[0028] 2) Inject the adhesive into the gap between the target material of the outer tube and the inner tube, wherein the adhesive includes silver conductive glue and copper wire;
[0029] 3) The binding is completed after the adhesive solidifies.
Embodiment 2
[0031] A rotating target cold binding process in this embodiment includes the following steps:
[0032] 1) Prepare 4 silicon tubes (the length of each silicon tube is 960mm) and matching 304 stainless steel tubes, put the 4 silicon tubes on the 304 stainless steel tubes for binding, the inner surface of the silicon tubes and the 304 stainless steel tubes The unilateral clearance of the outer surface is 1mm;
[0033] 2) Injecting the adhesive into the gap between the target material of the outer tube and the inner tube, wherein the adhesive includes silver conductive glue and aluminum wire;
[0034] 3) The binding is completed after the adhesive solidifies.
Embodiment 3
[0036] A rotating target cold binding process in this embodiment includes the following steps:
[0037] 1) Prepare 6 ITO (indium tin oxide) tubes (the length of each ITO tube is 300mm) and matching 304 stainless steel tubes, put the 6 silicon tubes on the 304 stainless steel tubes for binding, the inner surface of the ITO tubes The unilateral gap with the outer surface of the 304 stainless steel pipe is 1.5mm;
[0038] 2) Pressure inject the adhesive into the gap between the outer tube target and the inner tube, wherein the adhesive includes copper-silver conductive glue and copper wire;
[0039] 3) The binding is completed after the adhesive solidifies.
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Abstract
The invention discloses a cold binding process of a rotating target material, and belongs to the technical field of target materials. The cold binding process of the rotating target material comprisesthe following steps that 1, an outer tube target material sleeves a back tube; 2, an adhesive is pressed into a gap between the outer tube target material and an inner tube; and 3, after the adhesiveis solidified, the binding is connected. According to the cold binding process, air in the gap can be effectively extruded out, so that the bonding area of the outer tube target material and the backtube can reach 100%, no cavity is generated between an outer tube and the back tube, and the phenomenon of target cracking and target falling is effectively avoided in the sputtering process. Heatingis not required during binding, so that the back tube does not generate an expansion phenomenon; and a 304 stainless steel tube is adopted by the back tube, so that the back tube has the advantage ofbeing low in cost. The binding process can bind the target materials of any material, and the rotating target materials of any specification and any single section length (200mm-2000mm). The cold binding process has the advantages of being simple in operation, low in cost, energy-saving and environment-friendly and high in finished product qualification rate.
Description
technical field [0001] The embodiments of the present invention relate to the technical field of targets, and in particular to a cold binding process for rotating targets. Background technique [0002] The target is a solid material that is bombarded by high-speed energetic particles and can be deposited or reacted to form a film on the surface of the coating substrate. According to the shape of the sputtering surface, the target can be divided into planar target, rotating target and heterogeneous target. The rotating target is in the shape of a hollow tube, which can rotate around the fixed strip magnet assembly, and can uniformly etch the target surface at 360 degrees. It has the advantages of high utilization rate, good coating continuity, and uniform coating composition. [0003] The preparation methods of rotating targets include spraying method and binding method. The spraying method is to use plasma spraying equipment to spray powder such as silicon powder on the ba...
Claims
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Application Information
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