Array substrate and preparation method thereof, display panel and display device

Abstract

The invention discloses an array substrate and a preparation method thereof, a display panel and a display device, and aims at detecting via hole etching residual defects in the preparation process ofan array substrate so as to shorten the etching residual defect detection period and save cost. The array substrate provided by the embodiment of the invention comprises an underlayment substrate, aconductive shading layer on the underlayment substrate, an insulating layer on the conductive shading layer, and a source and drain electrode layer on the insulating layer, wherein the source-drain electrode layer is electrically connected with the conductive shading layer through a first via hole penetrating through the insulating layer and a second via hole penetrating through the conductive shading layer.

Description

technical field [0001] The present application relates to the field of display technology, in particular to an array substrate and a manufacturing method thereof, a display panel, and a display device. Background technique [0002] At present, there is contact hole etching in the organic light-emitting diode (Organic Light-Emitting Diode, OLED) display panel process. It is also getting thicker and thicker, and the difference between the uniformity of the film formation of the insulating layer and the uniformity of dry etching is getting larger and larger, and there are more and more cases of poor dry etching. Due to the increasing thickness of the interlayer insulating layer, the depth of the overlapping hole can reach more than 1000 nanometers (nm) at present, and the etching residue of the insulating layer is prone to appear. The subsequent leads cannot be overlapped through the overlapping hole, and the device cannot be lit. Defective dark spots. Moreover, in the proces...

AI Technical Summary

Problems solved by technology

[0002] At present, there is contact hole etching in the organic light-emitting diode (Organic Light-Emitting Diode, OLED) display panel process. It is also getting thicker, the difference between the uniformity of the insulating layer and the uniformity of dry etching is getting bigger and bigger, and there are more and more bad dry etching.

Due to the increasing thickness of the interlayer insulating layer, the depth of the overlapping hole can reach more than 1000 nanometers (nm) at present, and the etching residue of the insulating layer is prone to appear. The subsequent leads cannot be overlapped through the overlapping hole, and the device cannot be lit. Dysplasia

Moreover, in the process of the prior art, the etching residue of the insulating layer in the lap hole cannot be detected during the product manufacturing process. Only after the detection stage of product preparation is completed, can the black spot defect be detected, and the product with black spot defect Can only be scrapped, wasting materials and costs

[0003] To sum up, the existing technology cannot detect the etching residue of the overlapping holes during the preparation process of display products, and the defective products can only be scrapped, wasting materials and costs

Images