Catalyst-free curable epoxy compositions
A technology for curing epoxy resins and epoxy resins, applied in the field of curable epoxy resin compositions, can solve the problems of increasing the complexity and cost of the curing process, and deteriorating the performance of epoxy resin products.
Active Publication Date: 2020-03-20
SHPP GLOBAL TECH BV
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- Summary
- Abstract
- Description
- Claims
- Application Information
AI Technical Summary
Problems solved by technology
The use of curing catalysts can degrade the properties of the resulting cured epoxy product and add to the complexity and cost of the curing process
Method used
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Examples
Experimental program
Comparison scheme
Effect test
Embodiment 1
[0060] BPA-DGE was heated at 160°C and combined with BPA-DA at an anhydride to epoxy (A / E) ratio of 0.8:1 by weight. Provides a homogeneous and transparent reaction mixture. The reaction mixture was poured into preheated molds (130°C) and then cured in the mold at 220°C for 1 hour to provide rigid and transparent castings.
Embodiment 2
[0062] The same procedure as in Example 1 was followed except that the curing time was 3 hours.
Embodiment 3
[0064] The same procedure as in Example 1 was followed except that the curing time was 5 hours.
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Abstract
The invention relates to catalyst-free curable epoxy compositions. A curable epoxy composition, comprising: 100 parts by weight of an epoxy resin composition comprising one or more epoxy resins, eachindependently having an epoxy equivalent weight of at least 2; 30 to 200 parts by weight of an aromatic dianhydride curing agent of formula (1); wherein T is -O-, -S-, -C(O)-, -SO2-, -SO-, -CyH2y-; wherein y is an integer from 1 to 5 or a halogenated derivative thereof, or -O-Z-O- wherein Z is an aromatic C6-24monocyclic or polycyclic moiety optionally substituted with 1 to 6 C1-C8 alkyl groups, 1to 8 halogen atoms, or a combination comprising at least one of the foregoing; wherein the composition does not contain a catalyst.
Description
technical field [0001] The present invention relates to a catalyst-free curable (curable, curable) epoxy resin composition (epoxy composition, epoxy composition). Background technique [0002] Thermoset polymers are used in a variety of consumer and industrial products, including protective coatings, adhesives, electronic laminates (such as those used in printed circuit board manufacturing), flooring and paving, glass fiber-reinforced tubing, and automotive components (such as , leaf springs, pumps and electrical components). Thermoset epoxy resins are typically obtained from a combination of a co-reactive curing agent (also referred to in the art as a hardener) and a catalytic curing agent (also referred to in the art as a cure accelerator or catalyst). Polymerization in the presence provides a cured thermoset polymer. [0003] Anhydride curing agents can be used to provide cured epoxies with higher thermal properties, better electrical properties, longer pot life and low...
Claims
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IPC IPC(8): C08G59/42
CPCC08G59/4223C08L63/04C08G59/32C08G59/245C08L63/06
Inventor 穆克什·阿格拉沃尔尼基尔·K·E·韦尔盖塞
Owner SHPP GLOBAL TECH BV