A laser-assisted machining method for hard and brittle materials by laser-modified ultra-precision cutting
A laser-assisted, hard and brittle material technology, applied in the field of mechanical processing, can solve the problem that the geometric position relationship between the tool and the laser focus cannot be kept constant, and achieve the effect of convenient focusing and improved absorption rate
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specific Embodiment approach 1
[0047] Specific implementation mode one: combine Figure 1 to Figure 6 To illustrate this embodiment, the specific steps of a method for laser-assisted processing of hard and brittle materials by laser modified ultra-precision cutting described in this embodiment are as follows:
[0048] Step 1. Build a laser-assisted cutting platform;
[0049] Step 2. Focus the continuous laser beam generated by the laser output head on the surface of the workpiece;
[0050] Step 3, using the tool 2 to cut the modified workpiece surface.
specific Embodiment approach 2
[0051] Specific implementation mode two: combination Figure 1 to Figure 6 Describe this embodiment, the laser-assisted cutting platform in step 1 of the laser-assisted processing hard and brittle material method described in this embodiment includes a five-axis manual displacement platform 3 and a laser processing module 4, the laser processing module 4 installed on the five-axis manual displacement platform 3;
[0052] The steps to build a laser-assisted cutting platform are:
[0053] Step A, installing the laser processing module 4 on the five-axis displacement platform 3;
[0054] Step B, installing the five-axis displacement platform 3 on the ultra-precision machine tool 1;
[0055] Step C, installing the tool 2 on the ultra-precision machine tool 1 .
specific Embodiment approach 3
[0056] Specific implementation mode three: combination Figure 1 to Figure 6 Describe this embodiment, the five-axis manual displacement platform 3 of the laser-assisted processing hard and brittle material method described in this embodiment includes a vertical Y direction manual displacement platform 16, a connecting rib 17, a rotating R Direction manual displacement platform 18, linear Z direction manual displacement platform 19, linear X direction manual displacement platform 20 and linear W direction manual displacement platform 21; laser processing module 4 is installed on the linear W direction manual displacement platform 21, linear W direction manual displacement platform The platform 21 is installed on the manual displacement platform 16 in the vertical Y direction. The manual displacement platform 16 in the vertical Y direction is connected with the manual displacement platform 18 in the R direction through the connecting rib 17. The manual displacement platform 18 i...
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