Implantation method of z-pin large thickness

Abstract

The invention relates to a Z-pin variable-density prefabricated body and a Z-pin large-thickness implantation method, and belongs to the technical field of three-dimensional reinforcement of compositematerials. The Z-pin large-thickness implantation method comprises the steps that a proper Z-pin system is selected according to the implantation requirement of a prepreg blank to be reinforced, thelength of the Z-pin system is determined, the total thickness of a foam carrier is calculated according to the length of Z-pin, density distribution of the foam carrier is designed, and a corresponding prefabricated body is prepared through an implantation machine; and a heating device is started to heat the prepreg blank to be reinforced, the prefabricated body is placed over the blank, the middle is separated by a high-temperature-resistant isolating membrane, after the blank is uniformly heated, implantation of the Z-pin is started by implanting the Z-pin exposed out of foam into the blank,removing the uppermost layer of foam, continuing to implant the exposed Z-pin into the blank, and repeating foam removal and continuous implantation till all the Z-pin is implanted completely. Thus,large-thickness implantation target is achieved.

Description

technical field [0001] The invention belongs to the technical field of three-dimensional reinforcement of composite materials, and in particular relates to a variable-density prefabricated body structure and an ultrasonic-assisted layer-by-layer implantation method for realizing Z-pin large-thickness implantation. Background technique [0002] Composite materials have the unique advantages of light weight and high strength, and are widely used in the aerospace field, but the low interlayer strength becomes the bottleneck of its application. In order to improve the interlayer performance and interface connection performance of traditional composite materials, three-dimensional braided reinforced composite materials, Z-pin three-dimensional reinforcement technology and 2.5D interlayer reinforcement technology have emerged at home and abroad. , improve interlayer strength. Among them, the Z-pin three-dimensional reinforcement technology draws on the discontinuous suture method...

AI Technical Summary

Problems solved by technology

The Z-pin is a needle-like thin rod structure made of fibers impregnated in resin and co-cured by pultrusion. The axial modulus of the reinforcing fiber is low, resulting in insufficient rigidity and resistance when implanted with a large thickness (≥20mm). Large, Z-pin is prone to bending instability, and the existing implant technology cannot match the application requirements of large-thickness composite materials, and it is difficult to give full play to the unique advantages of composite materials, which restricts the further development of composite materials

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