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Dustproof structure for MEMS device and MEMS microphone packaging structure

A dust-proof structure and packaging structure technology, applied in the direction of sensors, microphones, loudspeakers, etc., can solve the problems of product quality degradation, warping and deformation of the isolation mesh and omentum, affecting the air flow at the omentum, etc., to relieve stress Function, the effect of preventing warping and deformation

Pending Publication Date: 2020-03-31
WEIFANG GOERTEK MICROELECTRONICS CO LTD
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

The above factors will cause the omentum on the isolation mesh to warp and deform, which cannot ensure that the omentum is in a flat state, which will further cause the quality of the product to decline, and even affect the airflow at the omentum

Method used

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  • Dustproof structure for MEMS device and MEMS microphone packaging structure
  • Dustproof structure for MEMS device and MEMS microphone packaging structure
  • Dustproof structure for MEMS device and MEMS microphone packaging structure

Examples

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Embodiment Construction

[0033] Various exemplary embodiments of the present invention will now be described in detail with reference to the accompanying drawings. It should be noted that the relative arrangements of components and steps, numerical expressions and numerical values ​​set forth in these embodiments do not limit the scope of the present invention unless specifically stated otherwise.

[0034] The following description of at least one exemplary embodiment is merely illustrative in nature and in no way taken as limiting the invention, its application or uses.

[0035] Techniques, methods and devices known to those of ordinary skill in the relevant art may not be discussed in detail, but where appropriate, such techniques, methods and devices should be considered part of the description.

[0036] In all examples shown and discussed herein, any specific values ​​should be construed as exemplary only, and not as limitations. Therefore, other instances of the exemplary embodiment may have dif...

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Abstract

The invention discloses a dustproof structure for an MEMS device and an MEMS microphone packaging structure. The dustproof structure for the MEMS device comprises a grid membrane and a carrier, the grid membrane is provided with a fixed connection area and an acoustic transmission area, the fixed connection area surrounds the acoustic transmission area, and the fixed connection area is located onthe edge of the grid membrane; the carrier is provided with a through opening; the opening corresponds to the position of the sound transmission area; the carrier comprises at least two carrier layers, a first carrier layer in the carrier layers is connected to one side of the fixed connection area, the other carrier layers are sequentially distributed on the side, away from the mesh membrane, ofthe first carrier layer in a stacked mode in the thickness direction of the mesh membrane, and the thermal expansion coefficients of the carrier layers are different.

Description

technical field [0001] The invention belongs to the technical field of acoustic-electric conversion, and in particular relates to a dust-proof structure for MEMS devices and a packaging structure for MEMS microphones. Background technique [0002] With the rapid development of electro-acoustic technology, various electro-acoustic products emerge in endlessly. As a transducer device that converts sound signals into electrical signals, the microphone is one of the most important devices in electroacoustic products. Today, microphones have been widely used in many different types of electronic products such as mobile phones, tablets, laptops, VR devices, AR devices, and smart wearables. In recent years, the design of the packaging structure of the microphone has become the focus and focus of research by those skilled in the art. [0003] The existing microphone packaging structure usually includes a housing with a cavity, and components such as chip components (eg, MEMS chips...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): H04R19/00H04R19/04
CPCH04R19/005H04R19/04H04R2201/003
Inventor 林育菁宫岛博志
Owner WEIFANG GOERTEK MICROELECTRONICS CO LTD
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