Pneumatic type multi-glue-barrel dispensing mechanism and dispensing method thereof

Abstract

The invention discloses a pneumatic type multi-glue-barrel dispensing mechanism and a dispensing method thereof. The mechanism comprises a stand column platform, a linear drive assembly, multiple dispensing units, multiple dispensing mechanical hands and a dispensing control box. The linear drive assembly which is transversely arranged is laid flat on the stand column platform. The multiple dispensing units which independently move leftwards and rightwards are arranged on the linear drive assembly. Each dispensing mechanical hand capable of being regulated up and down is arranged at the frontend of the corresponding dispensing unit. Glue barrels on the dispensing mechanical hands are connected with the dispensing control box through gas pipes. The multiple dispensing mechanical hands in the pneumatic type multi-glue-barrel dispensing mechanism can conduct dispensing on a support while doing multidimensional independent movement in the X direction, the Y direction and the Z direction,contact assemblies of the dispensing mechanical hands transmit electrical signals through closing and opening of upper contacts and lower contacts, the relative height of dispensing heads is confirmedthrough the electrical signals, the pressure in the glue barrels can be regulated through the dispensing control box, glue discharged from the dispensing heads can keep consistent micro glue sizes and shapes, and the dispensing speed and precision are remarkably increased.

Description

technical field [0001] The invention relates to the technical field of semiconductor packaging, in particular to a pneumatic multi-glue cartridge dispensing mechanism and a dispensing method for a solder paste dispensing process. Background technique [0002] The existing dispensing technology uses a single multi-tube dispensing head to dispense solder paste on the IC bracket. Due to the precision error of the machined parts, the tolerances of each part will accumulate during assembly and assembly, resulting in four points. The glue head is not in the same spatial position. When the dispensing head dispenses glue on the bracket, it will affect the size and thickness of the solder paste on the bracket, resulting in the loss of viscosity or excessive thickness of the solder paste in the chip packaging process; As the paste liquid level drops, the air pressure in it also changes, and there is a hidden danger of unstable glue output from the glue cartridge, resulting in inconsis...

AI Technical Summary

Problems solved by technology

[0002] The existing dispensing technology uses a single multi-tube dispensing head to dispense solder paste on the IC bracket. Due to the precision error of the machined parts, the tolerances of each part will accumulate during assembly and assembly, resulting in four points. The glue head is not in the same spatial position. When the dispensing head dispenses glue on the bracket, it will affect the size and thickness of the solder paste on the bracket, resulting in the loss of viscosity or excessive thickness of the solder paste in the chip packaging process; As the paste liquid level drops, the air pressure in it also changes, and there is a hidden danger of unstable glue output from the glue cartridge, resulting in inconsistent shapes and sizes of solder paste on the bracket, which affects the dispensing accuracy of the overall machine.

Moreover, the traditional structure of the dispensing head does not have the function of reflecting its status information. When the operator debugs the machine and replaces the dispensing head, he often can only correct the position of the dispensing head based on experience and feeling, and the dispensing of each adjustment The position of the head will be different, resulting in the inconsistent amount of glue on the bracket, and the product consistency is not good

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