Thermosetting resin composition, prepreg including thermosetting resin composition, and laminated board including preperg

Abstract

The invention provides a thermosetting resin composition, prepreg including thermosetting resin composition, and laminated board including preperg. The thermosetting resin composition comprises a phosphorus-nitrogen composite flame-retardant composition, epoxy resin and phenolic resin. The phosphorus-nitrogen composite flame-retardant composition comprises a component A and a component B, whereinthe component A is a DOPO derivative shown in a formula (1), and the component B is a melamine salt compound. According to the invention, the component A and the component B in the phosphorus-nitrogencomposite flame-retardant composition are matched, the halogen-free flame-retardant effect can be achieved under the condition of low additive amount, the UL 94V-0 level is achieved, meanwhile, the excellent heat resistance and machinability required by a composite substrate and the good dip soldering resistance can be met, and the excellent comprehensive performance of the composite substrate isguaranteed.

Description

technical field [0001] The invention belongs to the technical field of copper-clad laminated boards, and relates to a thermosetting resin composition, a prepreg and a laminated board using the same. Background technique [0002] CEM-1 composite base copper-clad laminate is made of electronic-grade glass fiber cloth and bleached wood pulp paper, respectively impregnated with a resin composition for copper-clad laminates, made of fabric and core material, and covered with copper Foil, made by hot pressing. Flame retardancy is the primary performance that CEM-1 copper-clad laminates must achieve. However, CEM-1 copper-clad laminates use wood pulp paper as the core material. The wood pulp paper itself is combustible. It is necessary to ensure that CEM- 1. Under the premise of other properties of copper clad laminates, especially heat resistance, toughness, moisture resistance and other properties, it is very difficult to improve the flame retardancy of CEM-1 copper clad laminat...

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Problems solved by technology

[0004] CN105542394A uses dimer acid modified bisphenol A type epoxy resin and phenol type novolac epoxy resin as the main epoxy resin, and utilizes bisphenol F type benzoxan Oxyzine resin, DOPO-based phenolic resin, melamine phenolic resin, and bisphenol A phenolic resin are used as curing agents, and a dimethylimidazole curing accelerator is added at the same time to obtain a halogen-free resin composition. The CEM made of this halogen-free resin composition -1 The board solves the problem of heat resistance and moisture resistance, but the entire patent does not mention whether the flame retardancy of the cured product can reach the UL 94V-0 level

[0005] CN110027276A uses bisphenol A type epoxy resin and phosphorus-containing epoxy resin as the main epoxy resin, and utilizes nitrogen-containing phenolic resin and vegetable oil modified phenolic resin as curing agent , while adding epoxy resin curing accelerator and some flame-retardant fillers to obtain a halogen-free paper-based adhesive, use this adhesive to make the lining, and then press and form the CEM-1 composite substrate with the fabric with high CTI , Halogen-free flame retardant properties. Although the patent mentions that the use of coated phosphorus-nitrogen flame retardants can improve the flame-retardant effect, it does not specify the type and characteri

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