A kind of micro-led chip and its preparation method, display device

A display device and chip technology, applied in semiconductor/solid-state device manufacturing, semiconductor devices, electrical components, etc., can solve problems such as the inability to meet the welding accuracy requirements of Micro-LED chips, and achieve the effect of reducing manufacturing costs and meeting welding accuracy requirements.

Active Publication Date: 2021-11-26
CHENGDU VISTAR OPTEOLECTRONICS CO LTD
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  • Abstract
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  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0006] The present application provides a Micro-LED chip, its preparation method, and a display device to solve the problem that the existing flip-chip welding process cannot meet the welding accuracy requirements of the Micro-LED chip

Method used

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  • A kind of micro-led chip and its preparation method, display device
  • A kind of micro-led chip and its preparation method, display device
  • A kind of micro-led chip and its preparation method, display device

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Embodiment Construction

[0045] At present, when preparing Micro-LED chips, due to the incompatibility of the process flow, the light-emitting chip and the driving backplane contained in the Micro-LED chip need to be prepared separately. After the light-emitting chip and the driving backplane are prepared, the electrodes of the light-emitting chip and the electrodes of the driving backplane can be electrically connected, so that the driving backplane can drive the light-emitting chip to emit light.

[0046] In the prior art, the light-emitting chip contained in the Micro-LED chip and the driving backplane are usually welded by a flip-chip welding process, so as to realize the electrical connection between the light-emitting chip and the driving backplane.

[0047] figure 1 It is a schematic diagram of realizing the electrical connection between the light-emitting chip and the driving backplane by flip-chip welding process in the prior art. Such as figure 1 As shown, first, the solder 12 can be prepa...

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Abstract

The present application discloses a Micro-LED chip, its preparation method, and a display device. The Micro-LED chip includes: a driving backplane and a light-emitting chip, and both the driving backplane and the light-emitting chip include electrodes, wherein: the Electrode grooves are prepared above the electrodes of the driving backplane, and the bottom of the electrode grooves expose the electrodes of the driving backplane; the electrode grooves are filled with conductors, and the electrodes of the driving backplane pass through the The conductors in the electrode grooves are connected to the electrodes of the light-emitting chip, wherein the conductors in the electrode grooves are obtained after thermal curing of a conductive liquid, and the conductive liquid has a thermal curing property. After heating and curing the conductive liquid with thermal curing properties, the light-emitting chip and the driving backplane are welded together to realize the electrical connection between the light-emitting chip and the driving backplane in the Micro-LED chip, which can effectively meet the welding accuracy requirements of the Micro-LED chip.

Description

technical field [0001] The present application relates to the field of display technology, in particular to a Micro-LED chip, a manufacturing method thereof, and a display device. Background technique [0002] Micro-LED chip is a new type of display chip, which has the characteristics of self-illumination, thin shape, high efficiency, high brightness, high resolution, fast response time, etc., and is increasingly used in various display and lighting fields. [0003] The Micro-LED chip includes two parts: a light-emitting chip and a driving backplane. Due to the incompatibility of the process flow, the light-emitting chip and the driving backplane need to be prepared separately. After the light-emitting chip and the driving backplane are prepared, the light-emitting chip and the driving backplane need to be electrically connected so that the driving backplane can drive the light-emitting chip to emit light. [0004] At present, the electrical connection between the light-em...

Claims

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Application Information

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Patent Type & Authority Patents(China)
IPC IPC(8): H01L27/15H01L21/77
CPCH01L21/77H01L27/156
Inventor 翟峰刘会敏王涛
Owner CHENGDU VISTAR OPTEOLECTRONICS CO LTD
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