Low-volatility heat-conducting gasket and preparation method thereof

A heat-conducting gasket, low-volatile technology, applied in chemical instruments and methods, heat exchange materials, etc., can solve problems such as affecting the brightness and clarity of lamps

Inactive Publication Date: 2020-04-10
SHENZHEN DARBOND INTERFACE MATERIALS
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

During the long-term use of the product, some small molecules inside the thermal pad will gradually volatilize, and because the gasket is encapsulated inside the lamp tube, the volatilized small molecules gather on the surface of transparent materials such as glass, which will seriously affect the performance of the lamp tube. Brightness and Clarity

Method used

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Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1

[0022] A low-volatility thermal pad, the components of which include, in parts by weight: 100 parts of vinyl silicone oil (vinyl content 0.05wt%, viscosity 500mPa·s), 5 parts of phenyl silicone oil (viscosity 300mPa·s) , 1 part of hydrogen-containing silicone oil (active hydrogen content 0.2wt%), 1 part of platinum catalyst, 3 parts of chain extender, 3 parts of fumed silicon, 800 parts of spherical alumina and 50 parts of zinc oxide.

[0023] The preparation method of the above-mentioned low-volatility thermal pad, the steps are as follows:

[0024] (1) Bake spherical alumina and zinc oxide at 105°C for 12 hours, cool to 15-25°C, and set aside;

[0025] (2) 100 parts of vinyl silicone oil (vinyl content 0.05wt%, viscosity 500mPa·s), 5 parts of phenyl silicone oil (viscosity 300mPa·s), 1 part of hydrogen-containing silicone oil (active hydrogen content 0.2wt%), platinum Add 1 part of catalyst and 3 parts of chain extender into the stirring tank and stir for 0.5h at a speed of...

Embodiment 2

[0028] A low-volatility thermal pad, the components of which include, in parts by weight: 100 parts of vinyl silicone oil (vinyl content 0.2 wt%, viscosity 800mPa·s), 15 parts of phenyl silicone oil (viscosity 500mPa·s) , 5 parts of hydrogen-containing silicone oil (active hydrogen content 0.3wt%), 3 parts of platinum catalyst, 5 parts of chain extender, 5 parts of fumed silicon, 1000 parts of spherical alumina and 100 parts of zinc oxide.

[0029] The preparation method of the above-mentioned low-volatility thermal pad, the steps are as follows:

[0030] (1) Bake spherical alumina and zinc oxide at 105°C for 12 hours, cool to 15-25°C, and set aside;

[0031] (2) 100 parts of vinyl silicone oil (vinyl content 0.2wt%, viscosity 800mPa·s), 15 parts of phenyl silicone oil (viscosity 500mPa·s), 5 parts of hydrogen-containing silicone oil (active hydrogen content 0.3wt%), platinum Add 3 parts of catalyst and 5 parts of chain extender into the stirring tank and stir for 0.5h at a s...

Embodiment 3

[0034] A low-volatility thermal pad, the components of which include, in parts by weight: 100 parts of vinyl silicone oil (vinyl content 0.3 wt%, viscosity 1000mPa·s), 10 parts of phenyl silicone oil (viscosity 600mPa·s) , 3 parts of hydrogen-containing silicone oil (active hydrogen content 0.5wt%), 2 parts of platinum catalyst, 4 parts of chain extender, 4 parts of fumed silicon, 900 parts of spherical alumina and 80 parts of zinc oxide.

[0035] The preparation method of the above-mentioned low-volatility thermal pad, the steps are as follows:

[0036] (1) Bake spherical alumina and zinc oxide at 105°C for 12 hours, cool to 15-25°C, and set aside;

[0037] (2) 100 parts of vinyl silicone oil (vinyl content 0.3wt%, viscosity 1000mPa·s), 10 parts of phenyl silicone oil (viscosity 600mPa·s), 3 parts of hydrogen-containing silicone oil (active hydrogen content 0.5wt%), platinum catalyst Add 2 parts and 4 parts of chain extender to the stirring tank and stir for 0.5h at a speed ...

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Abstract

The invention belongs to the technical field of organic silicon heat-conducting gaskets, and particularly relates to a low- volatility heat-conducting gasket and a preparation method thereof. According to the preparation method, the content of organic silicon monomers D4-D10 is controlled to be below 300ppm by selecting raw material resin, a heat-conducting filler is used after being baked at hightemperature, and loose and porous gas-phase silicon and a chain extender are added to react with small molecules, so that the heat-conducting gasket with low volatility is prepared. When the obtainedgasket is baked at 150 DEG C for 24 h, the weight loss is smaller than 0.03%, and the gasket can be successfully applied to the fields of monitoring and the like. The low-volatility heat-conducting gasket is used for monitoring and in the interiors of LED lamp tubes, can play a role in heat conduction and heat dissipation, and does not affect the brightness and definition of the lamps.

Description

technical field [0001] The invention belongs to the technical field of silicone thermal pads, in particular to a low-volatility thermal pad and a preparation method thereof. Background technique [0002] The thermal pad continuously dissipates the heat generated inside the electronic components, prolonging the life and stability of the product. During the long-term use of the product, some small molecules inside the thermal pad will gradually volatilize, and since the gasket is encapsulated inside the lamp tube, the volatilized small molecules gather on the surface of transparent materials such as glass, which will seriously affect the performance of the lamp tube. Brightness and clarity. Therefore, it is necessary to control the volatilization of the thermal pad so that the product will not affect the brightness and clarity of the product during use. [0003] The volatiles of thermal pads are mainly water vapor and small resin molecules. Water vapor is mainly introduced ...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): C08L83/07C08L83/04C08L83/05C08K7/26C08K7/18C08K3/22C08J5/18C09K5/14
CPCC08J5/18C08J2383/04C08J2483/04C08K7/18C08K7/26C08K2003/2293C08K2201/003C09K5/14
Inventor 万炜涛王红玉陈田安
Owner SHENZHEN DARBOND INTERFACE MATERIALS
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