Semiconductor device with double-sided heat dissipation structure, packaging device, and packaging method
A double-sided heat dissipation and semiconductor technology, which is applied in the direction of semiconductor devices, semiconductor/solid-state device manufacturing, semiconductor/solid-state device components, etc., can solve the problems of increasing process complexity and unfavorable cost for mass production, and reduce the cost of removing flash process, cost savings, and simplification of production steps
Active Publication Date: 2021-10-12
通富微电科技(南通)有限公司
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Problems solved by technology
[0002] The heat dissipation of the existing power module packaging generally adopts the method of setting a heat dissipation substrate on the semiconductor device for heat dissipation, but when setting the heat dissipation substrate, it needs to go through multiple reflow soldering processes. Due to the deformation and warpage of the substrate, there will be flashing on the heat dissipation surface of the heat dissipation substrate. The flashing needs to be removed, which increases the complexity of the process and the cost is not conducive to mass production.
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[0033] The application will be further described in detail below in conjunction with the accompanying drawings and embodiments. It should be understood that the specific embodiments described here are only used to explain related inventions, rather than to limit the invention. It should also be noted that, for ease of description, only parts related to the invention are shown in the drawings.
[0034] It should be noted that, in the case of no conflict, the embodiments in the present application and the features in the embodiments can be combined with each other. The present application will be described in detail below with reference to the accompanying drawings and embodiments.
[0035] Such as Figure 1-Figure 4 , Figure 6 , Figure 8 As shown, the package device of the semiconductor double-sided heat dissipation structure provided by the embodiment of the present application includes: a package frame 100, which is formed with a package cavity, and the package frame 10...
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This application discloses a semiconductor device with a double-sided heat dissipation structure, a packaging device, and a packaging method. Since multiple reflow soldering is required when setting up the heat dissipation structure of the semiconductor, the reflow soldering will cause the heat dissipation plate to warp. There will be flash at the warped position of the heat dissipation surface, and the flash will affect the heat dissipation of the heat dissipation plate and need to be removed, which increases the production cost. The first retaining wall and the second retaining wall set by the present application through the buckle, the first retaining wall At least one first boss is formed on the side wall of the wall, at least one second boss is formed on the side wall of the second retaining wall, and a glue injection hole, an exhaust hole, a first cover plate and a second cover plate are also included; Through the cooperation between the first cover plate and the second cover plate and the first boss and the second boss, the warping of the heat sink is suppressed, so that the first and second cover plates are in close contact with the heat sink, preventing Flash is generated on the heat dissipation surface of the heat sink, reducing the process of removing the flash.
Description
technical field [0001] This application generally relates to the field of semiconductor multi-chip power packaging, and specifically relates to a semiconductor device with a double-sided heat dissipation structure, a packaging device, and a packaging method. Background technique [0002] The heat dissipation of the existing power module packaging generally adopts the method of setting a heat dissipation substrate on the semiconductor device for heat dissipation, but when setting the heat dissipation substrate, it needs to go through multiple reflow soldering processes. Due to the deformation and warping of the substrate, there will be a problem of flashing on the heat dissipation surface of the heat dissipation substrate, and the flashing needs to be removed, which increases the complexity and cost of the process and is not conducive to mass production. Contents of the invention [0003] In view of the above-mentioned defects or deficiencies in the prior art, the present a...
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IPC IPC(8): H01L21/56H01L23/31H01L23/367
CPCH01L21/56H01L21/565H01L23/3107H01L23/367
Inventor 陈肖瑾姜峰朱正宇邢卫兵
Owner 通富微电科技(南通)有限公司