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Novel microphone packaging structure

A packaging structure and microphone technology, which is applied in the field of microphones, can solve the problems of reduced sensitivity of acoustic sensors, difficulty in pushing the diaphragm, and difficulty in air compression, and achieve the effects of increasing the area of ​​the rear chamber, improving clarity, and reducing the difficulty of vibration

Pending Publication Date: 2020-04-21
ZILLTEK TECH SHANGHAI +1
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

The front chamber of such a microphone is larger than the rear chamber, and the rear chamber space is smaller. Therefore, when the diaphragm vibrates toward the rear chamber, the air compression in the rear chamber is more difficult, and the diaphragm is pushed hard, which makes the sensitivity of the acoustic sensor decreases, the signal-to-noise ratio also decreases

Method used

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  • Novel microphone packaging structure
  • Novel microphone packaging structure
  • Novel microphone packaging structure

Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1

[0031] like figure 1 and figure 2 As shown, the present invention provides a novel microphone packaging structure, including

[0032] include

[0033] an acoustic sensor 5;

[0034] An ASIC chip 6 is connected with the acoustic sensor 5;

[0035] A printed circuit board 4, the printed circuit board 4 is provided with an opening 7, and the acoustic sensor 5 is installed at the opening 7;

[0036] A base plate 3, installed on the bottom of the printed circuit board 4, the base plate 3 is provided with a groove 8, and the groove 8 communicates with the opening 7;

[0037] A cover 1 is set on the printed circuit board 4 and forms an acoustic cavity with the printed circuit board 4 . The cover 1 is provided with an acoustic through hole 2 .

[0038] The advantages of the present invention are:

[0039] A bottom plate is added to the original microphone package, so that the bottom surface of the printed circuit board does not come into contact with the outside world, and the ...

Embodiment 2

[0053] Such as image 3 As shown, the structural components of the second embodiment are the same as those of the first embodiment, the only difference is that the bottom plate 3 is connected to the bottom end of the package case 1 in the first embodiment, and the bottom plate 3 of the second embodiment is embedded in the inside of the package case 1, at this time The top area of ​​the bottom plate 3 is consistent with the area formed by the bottom end of the inner wall of the package shell 1, so that the side of the bottom plate 3 is closely attached to the inner wall of the package shell 1, and the bottom plate 3 is tightly connected with the package shell 1 by welding, The sealant is used to fill the gap between the bottom plate 3 and the packaging shell 1 to keep the sealing of the microphone. In this case, the overall thickness of the microphone can be effectively reduced.

Embodiment 3

[0055] Such as Figure 4 As shown, the microphone package structure includes a package shell 1;

[0056] A bottom plate 3, connected to the packaging shell 1, a groove 8 is provided on the first end surface of the bottom plate 3;

[0057] An acoustic through hole 2 is arranged on the bottom plate 3, and the acoustic through hole 2 communicates with the groove 8;

[0058] A printed circuit board 4 is arranged on the first end of the base plate 3 and inserted into the packaging shell 1, and the printed circuit board 4 is provided with:

[0059] An acoustic sensor 5 corresponding to the position of the acoustic through hole 2;

[0060] An ASIC chip 6 is connected with the acoustic sensor 5;

[0061] An opening 7 corresponds to the position of the acoustic sensor 5 , and the opening 7 communicates with the groove 8 .

[0062] The difference from Embodiment 1 is that in Embodiment 1 there is no hole on the bottom plate, and an acoustic through hole is provided on the packaging ...

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Abstract

The embodiment of the invention discloses a novel microphone packaging structure, and the structure comprises an acoustic sensor and an dedicated integrated circuit chip which is connected with the acoustic sensor; a printed circuit board, wherein the printed circuit board is provided with an opening; a bottom plate which is mounted at the bottom of the printed circuit board, and a groove which isformed in the bottom plate; a cover body which covers the printed circuit board, and an acoustic through hole which is formed in the cover body. According to the invention, the bottom plate is addedon the basis of the original microphone package; the sealing performance of the printed circuit board is enhanced so that the service life of the printed circuit board is greatly prolonged, the safetyof the printed circuit board is greatly improved, the area of a rear cavity of the acoustic sensor is increased, the vibration difficulty of a vibrating diaphragm of the acoustic sensor is reduced, the sensitivity of the acoustic sensor is improved, the signal-to-noise ratio of the acoustic sensor and a microphone is increased, the noise is reduced, and the definition of the microphone is improved.

Description

technical field [0001] The invention relates to the field of microphones, in particular to a novel microphone packaging structure. Background technique [0002] MEMS (Micro Electromechanical System, Micro Electromechanical System) microphone is a microphone based on MEMS technology. Simply put, it is a capacitor integrated on a microsilicon chip, which can be manufactured by surface mount technology and can withstand high reflow temperature. [0003] Existing microphones generally convert sound signals into electrical signals through acoustic sensors. The sound hole of a general microphone is set on the package shell, and there is no hole on the PCB board. The space between the diaphragm and the sound hole of the acoustic sensor is called the front chamber, and the space between the diaphragm and the PCB board is the back chamber. . The front chamber of such a microphone is larger than the rear chamber, and the rear chamber space is smaller. Therefore, when the diaphragm v...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): H04R1/04H04R31/00
CPCH04R1/04H04R31/00H04R2201/003
Inventor 叶菁华
Owner ZILLTEK TECH SHANGHAI