Laser and preparation method and application thereof
A laser, all-in-one technology, used in lasers, laser parts, semiconductor lasers, etc., can solve problems such as poor manufacturing process, reduce space, small device size, and eliminate poor adhesion.
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[0047] The following will clearly and completely describe the technical solutions in the embodiments of the present invention with reference to the accompanying drawings in the embodiments of the present invention. Obviously, the described embodiments are only some, not all, embodiments of the present invention. Based on the embodiments of the present invention, all other embodiments obtained by persons of ordinary skill in the art without creative efforts fall within the protection scope of the present invention.
[0048] see Figure 1 to Figure 3 As shown, the present invention provides a laser 40 , which includes: a substrate 100 , a laser chip 200 , a package 300 and a first optical structure 400 .
[0049] see Figure 1 to Figure 3 As shown, in this embodiment, the substrate 100 is a circuit board, which is used to control the laser chip 200 to emit light. In some other embodiments, the substrate 100 may also be a support plate only used for supporting. There is no lim...
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Abstract
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