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Laser and preparation method and application thereof

A laser, all-in-one technology, used in lasers, laser parts, semiconductor lasers, etc., can solve problems such as poor manufacturing process, reduce space, small device size, and eliminate poor adhesion.

Inactive Publication Date: 2020-04-24
VERTILITE CO LTD
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

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Problems solved by technology

[0004] The object of the present invention is to provide a laser and its preparation method and application, which solves the problem of poor manufacturing process caused by connecting brackets and diffusers through adhesives in lasers

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  • Laser and preparation method and application thereof
  • Laser and preparation method and application thereof
  • Laser and preparation method and application thereof

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Embodiment Construction

[0047] The following will clearly and completely describe the technical solutions in the embodiments of the present invention with reference to the accompanying drawings in the embodiments of the present invention. Obviously, the described embodiments are only some, not all, embodiments of the present invention. Based on the embodiments of the present invention, all other embodiments obtained by persons of ordinary skill in the art without creative efforts fall within the protection scope of the present invention.

[0048] see Figure 1 to Figure 3 As shown, the present invention provides a laser 40 , which includes: a substrate 100 , a laser chip 200 , a package 300 and a first optical structure 400 .

[0049] see Figure 1 to Figure 3 As shown, in this embodiment, the substrate 100 is a circuit board, which is used to control the laser chip 200 to emit light. In some other embodiments, the substrate 100 may also be a support plate only used for supporting. There is no lim...

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Abstract

The invention discloses a laser and a preparation method and application thereof, and belongs to the technical field of semiconductors. The laser according to the present invention comprises a substrate, a laser chip which is arranged on the substrate and is electrically connected with the substrate, a packaging body which is formed on the substrate and wraps the laser chip, and a first optical structure which is formed on the side, away from the substrate, in the packaging body, wherein the first optical structure is integrally formed on the packaging body. According to the invention, the problem of poor manufacturing process caused by connecting a bracket and a diffuser through an adhesive in an emitter structure is solved.

Description

technical field [0001] The invention belongs to the technical field of semiconductors, and in particular relates to a laser and its preparation method and application. Background technique [0002] The Time Of Flight (TOF) method measures the time interval t (often called the pulse ranging method) of the pulse signal sent by the measuring instrument from transmission to reception (often called the pulse ranging method) or the phase generated by the laser going back and forth to the measured object once (phase difference measurement). distance method) to realize the measurement of the three-dimensional structure or three-dimensional profile of the measured object (or the detection area of ​​the measured object). Lasers based on the TOF method can obtain grayscale images and distance images at the same time, and are widely used in many fields such as somatosensory control, behavior analysis, monitoring, automatic driving, artificial intelligence, machine vision, and automatic ...

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): H01S5/022G01S7/481G01S7/4865G01S7/484
CPCG01S7/4814G01S7/484G01S7/4865H01S5/022H01S5/0225
Inventor 周特徐真真毛明明李齐柱张鹏飞
Owner VERTILITE CO LTD