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Refrigeration equipment with local cooling function and local refrigeration method

A technology of refrigeration equipment and local cooling, which is applied in the construction of electrical equipment components, cooling/ventilation/heating transformation, modification with liquid cooling, etc. It can solve the problems of inability to locally cool down electronic components and avoid useless cooling capacity Generate and prolong the circulation route and the effect of a large range of activities

Pending Publication Date: 2020-04-24
广东百奥电气有限公司
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  • Summary
  • Abstract
  • Description
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  • Application Information

AI Technical Summary

Problems solved by technology

[0003] In view of the deficiencies in the prior art above, the object of the present invention is to provide a refrigeration device with a local cooling function and a local refrigeration method, aiming at solving the problem that the refrigeration device in the prior art can only cool down the whole body and cannot target electronic components. Disadvantages of localized cooling

Method used

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  • Refrigeration equipment with local cooling function and local refrigeration method
  • Refrigeration equipment with local cooling function and local refrigeration method
  • Refrigeration equipment with local cooling function and local refrigeration method

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Embodiment Construction

[0023] The present invention provides a refrigeration device with local cooling function and a local refrigeration method. In order to make the purpose, technical solution and effect of the present invention clearer and clearer, the present invention will be further described in detail below with reference to the accompanying drawings and examples. It should be understood that the specific embodiments described here are only used to explain the present invention, not to limit the present invention.

[0024] see figure 1 , figure 2 , the present invention provides a kind of refrigerating equipment with partial cooling function, said refrigerating equipment comprises a compressor 1 connected by pipelines, a condenser 2, an evaporator 4, and a fan 3 used for heat exchange of the condenser, said evaporator The device 4 includes several cooling mechanisms 5, the cooling mechanism 5 includes a cooling plate 6 and a refrigerant channel 7 fixed on the back of the cooling plate, the ...

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Abstract

The invention discloses refrigeration equipment with a local cooling function and a local refrigeration method. The refrigeration equipment comprises a compressor, a condenser and an evaporator whichare connected through a pipeline. The evaporator comprises a plurality of cooling mechanisms, each cooling mechanism comprises a cooling plate and a refrigerant channel fixed to the back of the cooling plate, an inlet of each refrigerant channel is communicated with the condenser through a pipeline, and an outlet of each refrigerant channel is communicated with the compressor through a pipeline. According to the refrigeration equipment with a local cooling function and the local refrigeration method, the cooling mechanisms are arranged, so that local cooling of electronic components can be achieved, and the requirements of different electronic components for temperature are met; and due to the fact that heat exchange is directly conducted, compared with a traditional refrigerating system,the heat exchange is more efficient and concentrated, the cooling speed is high, the cooling effect is more remarkable, the cooling is more targeted, useless cooling capacity is avoided, and the energy efficiency of the refrigeration equipment is improved.

Description

technical field [0001] The invention relates to the technical field of refrigeration equipment, in particular to a refrigeration equipment with local cooling function and a local refrigeration method. Background technique [0002] In recent years, the electronic technology industry has developed particularly rapidly. Whether it is in the fields of computing, communication, or scientific research, electronic technology is inseparable; and the carrier of electronic technology, electronic components, has also been used more and more widely with the development of electronic technology. More and more extensive, the required functions are more and more powerful; and as electronic components operate more and more efficiently in the equipment, the heat generated by high-speed operation is also increasing, which is easy to cause damage to its own components, thus requiring Cool down the electronic components; the existing equipment for cooling down the components has relatively scar...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): H05K7/20
CPCH05K7/20309H05K7/20318H05K7/20354H05K7/20327H05K7/20381Y02B30/70
Inventor 罗家豪钟锦科
Owner 广东百奥电气有限公司
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