Electronic component resin packaging device and packaging method thereof
A technology for resin packaging devices and electronic components, which is applied in the fields of electrical components, semiconductor/solid-state device manufacturing, circuits, etc., can solve the problems of slow cooling speed of cooling methods, improve packaging quality, avoid resin waste, and facilitate use Effect
Active Publication Date: 2020-04-28
山东圣荣电子科技股份有限公司
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Problems solved by technology
[0005] Aiming at the deficiencies of the prior art, the present invention provides a resin packaging device for electronic components and a packaging method thereof, which has the advantages of fast cooling speed, etc., and solves the problem that the existing packaging device only uses a fan to process the packaged electronic components. Cooling, although this cooling method has a certain effect, the cooling speed of this cooling method is slow
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[0027] The following will clearly and completely describe the technical solutions in the embodiments of the present invention with reference to the accompanying drawings in the embodiments of the present invention. Obviously, the described embodiments are only some, not all, embodiments of the present invention. Based on the embodiments of the present invention, all other embodiments obtained by persons of ordinary skill in the art without making creative efforts belong to the protection scope of the present invention.
[0028] see Figure 1-3 , electronic component resin packaging device, including a base 1, a sealed box 2 is fixedly installed on the top of the base 1, a charging box 3 is fixedly installed on the top of the sealed box 2, a vacuum pump 4 is fixedly installed on the left side of the sealed box 2, and a vacuum pump 4 is fixedly installed on the top of the sealed box 2 The model of the model can be Fujiwara oil-free vacuum equipment. The top wall of the inner cav...
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The invention relates to the technical field of resin packaging of electronic components and discloses an electronic component resin packaging device. The device comprises a base; a sealing box is fixedly installed at the top of the base; a material accommodating box is fixedly installed at the top of the sealing box; a vacuum pump is fixedly installed on the left side of the sealing box; two electric push rods are fixedly installed on the top wall of an inner cavity of the sealing box; and the bottoms of the two electric push rods are fixedly connected with a movable plate. According to the electronic component resin packaging device and a packaging method thereof of the invention, a water tank, a water pump and a condensation pipe are arranged; water can be pumped to the condensation pipe; the condensation pipe cools the water; the water is conveyed into a worktable; a cooling effect is achieved on the workbench; a packaging box containing electronic components is cooled; resin in the packaging box containing the electronic components is cooled faster; it is avoided that the device takes up too long time in a packaging process; the machining speed and efficiency of the device areimproved; and the use of the device by a user is better facilitated.
Description
technical field [0001] The invention relates to the technical field of resin packaging of electronic components, in particular to a resin packaging device for electronic components and a packaging method thereof. Background technique [0002] Electronic components are basic elements in electronic circuits, usually individually packaged, and have two or more leads or metal contacts. Electronic components must be connected to each other to form an electronic circuit with specific functions, such as amplifiers, radio receivers and One of the common ways to connect electronic components, such as oscillators, is by soldering to a printed circuit board. [0003] At present, the existing packaging devices on the market are simple in structure and easy to use, but the existing packaging devices only cool the packaged electronic components through fans. Although this cooling method has certain effects, the cooling method is The cooling rate is slow, so a resin encapsulation device a...
Claims
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IPC IPC(8): H01L21/67H01L21/56
CPCH01L21/67121H01L21/561
Inventor 王武斌
Owner 山东圣荣电子科技股份有限公司