Liquid homogenizing device for printed circuit board

A printed circuit board and printed circuit technology, which is applied in the fields of printed circuit liquid treatment, printed circuit, printed circuit manufacturing, etc., can solve problems such as unevenness, pool effect treatment effect, etc., to prevent excessive treatment, avoid pool effect, and avoid treatment uneven effect

Pending Publication Date: 2020-04-28
UNIVERSAL CIRCUIT BOARD EQUIP CO LTD
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0003] The purpose of the present invention is to provide a printed circuit board homogeneous liquid treatment device, aiming to solve the technical problem in the prior art that horizontal placement of sheet materials tends to produce pool effect and vertical placement tends to cause uneven treatment effect

Method used

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  • Liquid homogenizing device for printed circuit board
  • Liquid homogenizing device for printed circuit board
  • Liquid homogenizing device for printed circuit board

Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1

[0049] see figure 1 , the present invention provides a printed circuit board uniform solution processing device for processing printed circuit board 90, printed circuit board 90 is sheet-shaped and has a surface to be treated, wherein, printed circuit board 90 can have a surface to be treated, or can There are two opposite faces to be processed. It should be noted that the uniform liquid treatment device for printed circuit boards is especially used for processing the printed circuit boards 90 whose surface to be treated has been soaked with the chemical solution.

[0050] see figure 1 and figure 2 , The uniform solution processing device for printed circuit boards includes a loading mechanism 10 , a driving mechanism, a first supporting mechanism 30 and a first limiting mechanism 50 .

[0051] Wherein, the loading mechanism 10 is used to fix the printed circuit board 90 and make the plane where the printed circuit board 90 is located perpendicular to the horizontal plane....

Embodiment 2

[0061] The second embodiment provides a printed circuit board uniform liquid processing device. Compared with the first embodiment, the difference lies in that the drive mechanism also includes a second The transmission assembly 60 , the first transmission assembly 20 and the second transmission assembly 60 are located at both ends of the loading tray 11 in the radial direction, so as to clamp the loading tray 11 together. Wherein, the second transmission assembly 60 is driven without power, and after the first transmission assembly 20 drives the loading tray 11 to rotate, the loading tray 11 can drive the second transmission assembly 60 to move through the friction force of the contact surface with the second transmission assembly 60 . The second transmission assembly 60 is preferably in contact with the edge surface 112 , and the first supporting mechanism 30 and the first transmission assembly 20 jointly clamp the loading tray 11 through the second transmission assembly 60 t...

Embodiment 3

[0065] The setting of the second limit mechanism in the second embodiment increases the frictional force when the loading tray 11 rotates. To solve this problem, please refer to image 3 and Figure 4 The present embodiment 3 provides a printed circuit board homogeneous liquid processing device. Compared with the embodiment 1, the difference lies in that the driving mechanism also includes a first supporting mechanism 30 and abutting against the loading tray 11 Two transmission components 60, the second transmission component 60 includes a first limiting wheel 61 and a second limiting wheel 62 arranged in sequence along the moving direction of the loading tray 11 and located on the moving path of the loading tray 11, the first limiting wheel Both the wheel 61 and the second limiting wheel 62 can move toward or away from the first transmission assembly 20 , and the second transmission assembly 60 has a limiting state and an advancing state.

[0066] When the second transmissio...

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PUM

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Abstract

The invention provides liquid homogenizing device for a printed circuit board. The device is used for treating the printed circuit board, the printed circuit board is provided with a to-be-treated surface and comprises a material carrying mechanism and a driving mechanism, and the material carrying mechanism is used for fixing the printed circuit board and enabling the plane where the printed circuit board is located to be perpendicular to the horizontal plane; and the driving mechanism is used for driving the material carrying mechanism to rotate around the rotating axis perpendicular to theto-be-treated surface. After the to-be-treated surface is soaked in the liquid medicine, the liquid medicine can uniformly flow to the area of the lower half part from the area of the upper half partunder the effect of gravity; the liquid medicine in each area sequentially flows downwards in the circumferential direction in the rotating process of the material carrying mechanism; and finally, uniform coverage of the liquid medicine in each area of the to-be-treated surface is realized, so that the pool effect during horizontal placement is avoided, excessive local area treatment caused by residual liquid medicine is prevented, and the condition of non-uniform treatment effect of the upper part and the lower part during vertical placement of the printed circuit board is avoided.

Description

technical field [0001] The invention belongs to the technical field of sheet material processing equipment, and in particular relates to a uniform liquid processing device for printed circuit boards. Background technique [0002] During the processing of printed circuit boards, the mother board generally needs to be developed, washed, etched, and dried in sequence. The existing uniform liquid treatment device usually places and positions the mother board horizontally or vertically and then processes it. . If the motherboard is placed horizontally, ideally, the chemical solution sprayed on the motherboard for development or etching during the in-situ processing or translation processing of the motherboard can be evenly distributed on the board under the action of gravity, but in In the actual processing process, it is difficult to place the printed circuit board completely horizontally during positioning, which will form a pool effect on the board surface, resulting in the a...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): H05K3/00
CPCH05K3/0085H05K2203/0165H05K2203/0736
Inventor 陈德和
Owner UNIVERSAL CIRCUIT BOARD EQUIP CO LTD
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