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Polishing head for chemical mechanical polishing system and chemical mechanical polishing method

A technology of chemical machinery and grinding method, which is applied in the direction of grinding tools, parts of grinding machine tools, grinding/polishing equipment, etc., and can solve problems such as interference with photolithography process, uneven morphology, and difficulties

Active Publication Date: 2021-05-14
TAIWAN SEMICON MFG CO LTD
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

For example, forming metal features in a substrate or in a metal layer can result in non-uniform topography
This inhomogeneous morphology creates difficulties in the formation of subsequent layers
For example, non-uniform topography can interfere with the photolithography process used to form various features in the device

Method used

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  • Polishing head for chemical mechanical polishing system and chemical mechanical polishing method
  • Polishing head for chemical mechanical polishing system and chemical mechanical polishing method
  • Polishing head for chemical mechanical polishing system and chemical mechanical polishing method

Examples

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Embodiment Construction

[0053] The following disclosure provides many different embodiments, or examples, for implementing different features of the provided subject matter. Specific examples of components and arrangements are described below to simplify the present disclosure. Of course, these are examples only, and are not intended to be limiting. For example, in the following description a first feature is formed on or over a second feature may include embodiments in which the first feature is formed in direct contact with the second feature, and may also include embodiments in which additional features Embodiments may be formed between a first feature and a second feature such that the first feature and the second feature may not be in direct contact. Additionally, the present disclosure may repeat element symbols and / or letters in various instances. This repetition is for simplicity and clarity and does not in itself indicate a relationship between the various embodiments and / or configurations...

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Abstract

Provided are a polishing head for a chemical mechanical polishing system and a chemical mechanical polishing method. The grinding head includes a bearing head, a membrane installed on the bearing head, an inner fixing ring installed on the bearing head and surrounding the membrane, an outer fixing ring installed on the bearing head and surrounding the inner fixing ring, and an image capture element. The outer retaining ring is spaced apart from the inner retaining ring. The image capture element is installed on the bearing head and between the inner fixing ring and the outer fixing ring.

Description

technical field [0001] This application relates to a chemical mechanical polishing device and method. Background technique [0002] In general, semiconductor elements include active components, such as transistors, formed on a substrate. Any number of interconnect layers may be formed over the substrate to connect active components to each other and to external components. The interconnect layers may be made of low-k dielectric materials, including metal-containing trenches / vias. [0003] When forming layers of an element, it may be necessary to planarize the element. For example, forming metal features in a substrate or in a metal layer can result in non-uniform topography. This uneven morphology creates difficulties in the formation of subsequent layers. For example, non-uniform topography may interfere with photolithography processes used to form various features in the device. Therefore, there is a need to planarize the surface of the element after forming the vario...

Claims

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Application Information

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Patent Type & Authority Patents(China)
IPC IPC(8): B24B37/12B24B37/30B24B53/017H01L21/768
CPCB24B37/12B24B37/30B24B53/017H01L21/7684B24B37/32B24B49/12H01L21/3212
Inventor 陈彦良刘俊秀周佳贤
Owner TAIWAN SEMICON MFG CO LTD