Power module with low parasitic inductance layout
A low parasitic inductance, power module technology, applied in the direction of circuits, electrical components, electric solid-state devices, etc., can solve the problems of power electronic power module switching frequency increase, large parasitic inductance, voltage overshoot, etc., to increase overcurrent capability, Effect of reducing loop inductance and increasing power level
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[0041] The technical solution of the present invention will be further described in conjunction with the accompanying drawings and embodiments.
[0042] This embodiment proposes a new type of power module with low parasitic inductance and high reliability. By stacking the busbars and combining the reasonable layout of the internal circuit of the module, the purpose of reducing the parasitic inductance of the packaging structure is achieved; at the same time, the power terminal adopts ultrasonic The welding method improves the working life of the power electronic power module.
[0043] like Figure 1 to Figure 5 As shown, this embodiment takes the three-phase bridge structure as an example, including positive electrode 1, negative electrode 2, output electrode 3, outer frame, cover plate, heat dissipation bottom plate A, upper half-bridge drive terminal, lower half-bridge drive terminal and sampling Terminals, the positive electrode 1, negative electrode 2, and output electrod...
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