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VECSEL laser chip packaging structure and method capable of avoiding magnetic field interference

A chip packaging structure and laser technology, applied in lasers, laser components, semiconductor lasers, etc., to achieve low power consumption, shrink package volume, and improve performance

Pending Publication Date: 2020-05-05
ZHEJIANG UNIV OF TECH
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

Most of the packages are mainly aimed at laser thermal control solutions, and few solutions consider the magnetic field interference introduced by the package.

Method used

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  • VECSEL laser chip packaging structure and method capable of avoiding magnetic field interference
  • VECSEL laser chip packaging structure and method capable of avoiding magnetic field interference
  • VECSEL laser chip packaging structure and method capable of avoiding magnetic field interference

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Embodiment Construction

[0026] In order to make the solution of the present invention clearer, further description will be made below in conjunction with the accompanying drawings and specific implementation methods.

[0027] like figure 1 and 2 As shown, a VECSEL laser chip packaging structure that avoids magnetic field interference includes a substrate 1 , a lower insulating layer 2 , and an upper insulating layer 3 in sequence from bottom to top. The lower insulating layer 2 is attached to the base 1, and the lower insulating layer 2 is arranged with a temperature measuring coil 4, a heating coil 5, a VECSEL power supply positive electrode pin 6, and a VECSEL power supply negative electrode pin 7. The upper insulating layer 3 covers the temperature measuring coil 4 and the heating coil 5 , and a VECSEL power supply negative electrode 8 is arranged in the center of the upper insulating layer 3 .

[0028] like figure 2 As shown, the temperature measuring coil 4 is a circular shape with an openin...

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Abstract

The invention discloses a VECSEL laser chip packaging structure and method capable of avoiding magnetic field interference. A temperature measuring coil, a heating coil, a power supply positive electrode pin and a power supply negative electrode pin are arranged on a lower insulating layer. An upper insulating layer covers the temperature measuring coil and the heating coil, and a power supply negative electrode is arranged on the upper insulating layer. The temperature measuring coil is in a circular ring shape with an opening, and the heating coil is in a double-vortex curve shape and located in the temperature measuring coil. Firstly, the lower insulating layer is deposited on a substrate, then the temperature measuring coil and the pin, the heating coil and the pin, and the power supply positive electrode pin are machined on the lower insulating layer, then the upper insulating layer is deposited on the temperature measuring coil and the heating coil, and finally the power supply negative electrode and the pin are machined at the same time. According to the invention, by utilizing the staggered double-vortex-curve heating coil structure, the area occupied by the heating coil can be reduced, and meanwhile, the magnetic field interference caused by a magnetic field generated by heating and temperature measuring current to a device can be avoided.

Description

technical field [0001] The invention belongs to the technical field of chip packaging, and in particular relates to a VECSEL laser chip packaging structure and a processing method for avoiding magnetic field interference. Background technique [0002] As an important light source for chip-level devices, chip-level vertical cavity surface-emitting lasers (VECSEL) are an important part of new sensors such as on-chip atomic magnetometers and atomic clocks. Aiming at specific application environments, a laser that can avoid magnetic field interference is realized. The packaging scheme has attracted much attention. [0003] In order to realize the integrated packaging of semiconductor laser machines in the application environment, various structures have been widely proposed in recent years. Most of the packages are mainly aimed at laser thermal control solutions, and few solutions consider the magnetic field interference introduced by the package. In some application scenarios...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): H01S5/024H01S5/026H05K9/00
CPCH01S5/02453H01S5/0261H05K9/00
Inventor 林强李德钊黄宇翔
Owner ZHEJIANG UNIV OF TECH
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