Vapor deposition source for vacuum vapor deposition apparatus

An evaporation source and evaporation technology, applied in vacuum evaporation coating, lighting devices, light sources, etc., can solve the problems of low evaporation rate, small sublimation amount, and low productivity of the evaporated material

Inactive Publication Date: 2020-05-05
ULVAC INC
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

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Problems solved by technology

As a result, there is a problem that the sublimated material can only be scattered from a limited range, so that the amount of sublimation per unit time is small under the same pressure, and the evaporation rate of the object to be evaporated is low (that is, the productivity is low).
In this case, it may be considered to increas

Method used

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  • Vapor deposition source for vacuum vapor deposition apparatus
  • Vapor deposition source for vacuum vapor deposition apparatus
  • Vapor deposition source for vacuum vapor deposition apparatus

Examples

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Embodiment Construction

[0017] Referring to the accompanying drawings, a glass substrate with a predetermined thickness having a rectangular outline (hereinafter referred to as "substrate Sw") is used as the vapor-deposited object, and a sublimable organic material is used as the vapor-deposited substance to vapor-deposit a predetermined film on one side of the substrate Sw. Taking the case of the present invention as an example, an embodiment of the vapor deposition source for a vacuum vapor deposition device according to the present invention will be described. The following words such as "up" and "down" indicating directions are used to show the setting posture of the vacuum evaporation device. figure 1 as the benchmark.

[0018] refer to figure 1 , Dm is a vacuum vapor deposition device having the vapor deposition source DS of this embodiment. The vacuum evaporation device Dm has a vacuum chamber 1, although not illustrated in particular, but the vacuum chamber 1 is connected to a vacuum pump t...

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Abstract

Provided is a vapor deposition source for a vacuum vapor deposition apparatus with which it is possible to increase the amount of sublimation per unit time when vapor-depositing a sublimatable material and the rate of vapor deposition on the vapor deposition-receiving object is high. This vapor deposition source DS for a vacuum vapor deposition apparatus Dm is disposed in a vacuum chamber 1 and isfor sublimating a sublimatable organic material 7 and vapor-depositing the same on a vapor deposition-receiving object Sw. The vapor deposition source is provided with: an upper side opening 4 with acrucible 41 for jetting sublimated material toward the vapor deposition-receiving object Sw; a cylinder 5, which is inserted through said upper side opening 4, leaving a gap from the wall surface thereof, and is for holding the sublimatable material; and a heating means Ht, which enables heating of the material inside the cylinder 5. Multiple mesh openings 52 are provided in the cylinder 5 for allowing passage of sublimated material.

Description

technical field [0001] The present invention relates to an evaporation source for a vacuum evaporation device arranged in a vacuum chamber for sublimating a sublimable material and evaporating an object to be evaporated. Background technique [0002] For example, in the manufacturing process of organic EL elements, there is a quinoline aluminum complex (Alq 3 ) and a sublimable material (organic material) such as aromatic diamine are vapor-deposited on a substrate such as a substrate in a vacuum atmosphere, and a vacuum vapor deposition apparatus is widely used in this vapor deposition step. A vapor deposition source used in such a vacuum vapor deposition apparatus is known in Patent Document 1, for example. The device has: a crucible with an opening on the surface in the vertical direction; and a heating unit such as an induction coil for heating the crucible (refer to the column of prior art). [0003] Here, the above-mentioned types of materials generally have poor ther...

Claims

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Application Information

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IPC IPC(8): C23C14/24H01L51/50H05B33/10
CPCH05B33/10C23C14/24H10K50/00C23C14/243C23C14/12H10K71/164
Inventor 中村寿充清健介
Owner ULVAC INC
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