Alignment system, film forming apparatus, alignment method, film forming method, and method for manufacturing electronic device

Abstract

The invention provides an alignment system, a film forming apparatus, an alignment method, a film forming method, and a method of manufacturing an electronic device. The alignment system is used for adjusting the relative positions of a substrate and a mask, and is characterized by comprising an electrostatic chuck, an alignment device and a control device, and the electrostatic chuck is used foradsorbing the substrate; the separation state detection mechanism is used for detecting the separation state of the mask and the substrate adsorbed by the electrostatic chuck; the position adjusting mechanism is used for adjusting the relative positions of the mask and the substrate adsorbed by the electrostatic chuck; and a control unit, the control part is used for controlling the electrostaticchuck, the separation state detection mechanism and the position adjustment mechanism; the control unit determines whether to start adjustment of the relative positions of the substrate and the mask by the position adjustment mechanism on the basis of the state of separation of the substrate and the mask detected by the separation state detection mechanism.

Description

technical field [0001] The invention relates to an alignment system, a film forming device, an alignment method, a film forming method and a manufacturing method of an electronic device. Background technique [0002] In the manufacture of an organic EL display device (organic EL display), when forming an organic light-emitting element (organic EL element; OLED) constituting an organic EL display device, the vapor deposition material evaporated from the vapor deposition source of the film formation device An organic layer or a metal layer is formed by vapor deposition on a substrate through a mask on which a pixel pattern is formed. [0003] In an upward deposition method (upward deposition) film formation device, the deposition source is installed in the lower part of the vacuum chamber of the film formation device, the substrate is arranged in the upper part of the vacuum chamber, and vapor deposition is performed on the lower surface of the substrate. In the vacuum contai...

AI Technical Summary

Problems solved by technology

[0010] However, in the prior art, when the electrostatic chuck holding the substrate is brought close to the mask for alignment between the substrate and the mask in the state where the substrate is held by the electrostatic chuck, the mask is The chuck is attracted by electrostatic force and is in contact with the lower surface of the substrate

In this state, if the position of the substrate and the mask is adjusted, the pattern of pixels formed on the lower surface of the substrate will be damaged by the mask.

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