A kind of preparation method of silicon carbide film continuous carbon fiber plate
A carbon fiber board, silicon carbide film technology, applied in gaseous chemical plating, coating, metal material coating process and other directions, can solve the problems of high energy consumption, low structural strength, twice the result with half the effort, etc., to achieve energy-saving production efficiency, save raw materials , the effect of high production efficiency
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Embodiment 1
[0020] The pitch of T300 carbon fiber bundles is 5µm;
[0021] The carbon fiber plate is heated to 1100°C;
[0022] Trichloromethylsilane gas: hydrogen: the mol ratio of argon is 1:6:8, and flow control is at 1200ml / min;
[0023] The linear velocity of the rotating speed of the stick graphite roller (9) (10) is 2cm / min;
[0024] The SiC film thickness is 9.1 µm.
Embodiment 2
[0026] The pitch of T300 carbon fiber bundles is 3µm;
[0027] The carbon fiber plate is heated to 1000°C;
[0028] Trichloromethylsilane gas: hydrogen: the mol ratio of argon is 1:8:10, and flow control is at 600ml / min;
[0029] The linear velocity of the rotating speed of the stick graphite roller (9) (10) is 0.6cm / min;
[0030] The SiC film thickness is 5.3 µm.
Embodiment 3
[0032] The pitch of T300 carbon fiber bundles is 0.5µm;
[0033] The carbon fiber plate is heated to 900°C;
[0034] Trichloromethylsilane gas: hydrogen: the mol ratio of argon is 1: 10: 12, and flow control is at 100ml / min;
[0035] The linear velocity of the rotating speed of the stick graphite roller (9) (10) is 0.8cm / min;
[0036] The SiC film thickness is 1.6 µm.
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