Wafer detection method and wafer detection equipment

Abstract

The invention provides a wafer detection method and wafer detection equipment, and belongs to the technical field of wafer detection. The wafer detection method comprises the following steps: providing a wafer and a probe, wherein the wafer is provided with a welding disc; determining an initial position, wherein the probe contacts the welding disc at the initial position; controlling the probe tomove to a plurality of detection positions in a set direction; when the probe is located at each detection position, detecting whether the voltage of the probe is located in a preset range; in each detection position where the voltage of the probe is located in the preset range, selecting the detection position with the maximum deviation relative to the initial position along the set direction asthe limit detection position of the set direction; determining an offset range according to the offset of the limit detection position in the set direction relative to the initial position, wherein the offset is a vector; and controlling the probe to move and detecting the wafer according to the offset range. According to the wafer detection method, the position of the probe can be rapidly and accurately controlled, and the wafer detection period is shortened.

Description

technical field [0001] The present disclosure relates to the technical field of wafer inspection, and in particular, to a wafer inspection method and inspection equipment. Background technique [0002] Wafer testing is an important process in the preparation of integrated circuits. It generally uses the probe integrated on the probe card to contact the pads of each chip (die) on the wafer, and then uses electrical testing equipment to test the chip. performance is checked. [0003] During testing, when the probe is in effective contact with the pad, a needle mark will be left on the pad. Therefore, in the prior art, optical means (such as visual inspection or machine vision) are usually used to detect the needle mark, and then determine the probe offset Is the location appropriate. However, wafer inspection involves multiple test sites and different test steps. Repeated inspection of the needle marks to determine whether the probe position setting is appropriate is not onl...

AI Technical Summary

Problems solved by technology

However, wafer inspection involves multiple test sites and different test steps. It is not only very cumbersome to repeatedly detect needle marks to determine whether the probe position is set properly, but also increases the test cycle; and after repeated contact between the pad and the probe Multiple pin marks will be left, which makes pin mark identification difficult

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