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Dustproof structure for MEMS device and MEMS microphone packaging structure

A dust-proof structure and microphone technology, which is applied in the direction of sensors, microphones, loudspeakers, etc., can solve the problems of product quality degradation, isolation mesh omentum folds or wrinkles, and affecting air flow at the omentum, so as to release stress, The effect of avoiding wrinkles and alleviating deformation

Pending Publication Date: 2020-05-12
WEIFANG GOERTEK MICROELECTRONICS CO LTD
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

The above factors will cause the omentum on the isolation mesh to wrinkle or wrinkle, which cannot ensure that the omentum is in a flat state, which will further cause the quality of the product to decline, and even affect the airflow at the omentum

Method used

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  • Dustproof structure for MEMS device and MEMS microphone packaging structure
  • Dustproof structure for MEMS device and MEMS microphone packaging structure
  • Dustproof structure for MEMS device and MEMS microphone packaging structure

Examples

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Embodiment Construction

[0034] Various exemplary embodiments of the present invention will now be described in detail with reference to the accompanying drawings. It should be noted that the relative arrangements of components and steps, numerical expressions and numerical values ​​set forth in these embodiments do not limit the scope of the present invention unless specifically stated otherwise.

[0035] The following description of at least one exemplary embodiment is merely illustrative in nature and in no way taken as limiting the invention, its application or uses.

[0036] Techniques, methods and devices known to those of ordinary skill in the relevant art may not be discussed in detail, but where appropriate, such techniques, methods and devices should be considered part of the description.

[0037] In all examples shown and discussed herein, any specific values ​​should be construed as exemplary only, and not as limitations. Therefore, other instances of the exemplary embodiment may have dif...

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Abstract

The invention discloses a dustproof structure for an MEMS device and an MEMS microphone packaging structure. The dustproof structure for the MEMS device comprises a grid film and a carrier, wherein the grid membrane is provided with a fixed connection area, a buffer area and an acoustic transmission area, the buffer area surrounds the acoustic transmission area, the fixed connection area surroundsthe buffer area, the fixed connection area is located on the edge of the grid membrane, and a through hole penetrating through the grid membrane is formed in the buffer area; the carrier is providedwith a through opening, the carrier is connected to one side of the fixed connection area, and the position of the opening corresponds to the positions of the buffer area and the sound transmission area.

Description

technical field [0001] The invention belongs to the technical field of acoustic-electric conversion, and in particular relates to a dust-proof structure for MEMS devices and a packaging structure for MEMS microphones. Background technique [0002] With the rapid development of electro-acoustic technology, various electro-acoustic products emerge in endlessly. As a transducer device that converts sound signals into electrical signals, the microphone is one of the most important devices in electroacoustic products. Today, microphones have been widely used in many different types of electronic products such as mobile phones, tablets, laptops, VR devices, AR devices, and smart wearables. In recent years, the design of the packaging structure of the microphone has become the focus and focus of research by those skilled in the art. [0003] The existing microphone packaging structure usually includes a housing with a cavity, and components such as microphone devices (eg, MEMS ch...

Claims

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Application Information

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IPC IPC(8): H04R19/00H04R19/04H04R31/00
CPCH04R19/005H04R19/04H04R31/00H04R31/003H04R2201/003H04R2231/001
Inventor 林育菁
Owner WEIFANG GOERTEK MICROELECTRONICS CO LTD
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