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Circuit board manufacturing method

A circuit board manufacturing, circuit board technology, applied in the direction of printed circuit manufacturing, printed circuit, electrical components, etc., can solve the problem that the accuracy of exposure alignment cannot be reduced, and achieve the effect of increasing density

Active Publication Date: 2020-05-12
UNIMICRON TECH CORP
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

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Problems solved by technology

However, since the exposure alignment accuracy cannot be reduced, the use of solder plated on pad (SPOP) method to form metal bumps on circuit boards or substrates has faced a technical bottleneck

Method used

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  • Circuit board manufacturing method
  • Circuit board manufacturing method
  • Circuit board manufacturing method

Examples

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Embodiment Construction

[0017] The invention below provides many different embodiments, or examples, to implement different features of the objects provided. Specific examples of components and arrangements are set forth below for the purpose of simplifying the present disclosure. These are of course only examples and are not intended to be limiting. For example, the dimensions of the device are not limited by the scope or values ​​of the invention, but may depend on the process conditions and / or desired characteristics of the device. In addition, the description that the first feature is formed on or over the second feature includes the embodiment that the first feature and the second feature are in direct contact, and also includes other features formed between the first feature and the second feature, such that the second feature An embodiment in which a first feature is not in direct contact with a second feature. Various features may be arbitrarily shown with different sizes for simplicity and...

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Abstract

The invention provides a circuit board manufacturing method, which comprises the following operations: providing a base plate, wherein the base plate comprises a bottom layer and a resin layer, the resin layer is located on the bottom layer and comprises a first surface and a second surface opposite to the first surface, and the first surface is in contact with the bottom layer; forming a plurality of holes penetrating through the resin layer; depositing a first metal layer in the holes, wherein the first metal layer contacts the bottom layer and fills part of each hole; depositing a second metal layer on the first metal layer, wherein the second metal layer is located in the hole; forming a patterned metal layer on the second metal layer, wherein the patterned metal layer extends from each hole to the second surface; separating the bottom layer from the resin layer; and removing part of the resin layer from the first surface, so that the first metal layer projects out of the resin layer. The circuit board manufacturing method provided by the invention can be used for manufacturing a circuit board with small bump spacing, so that the density of the assembly can be greatly increased.

Description

technical field [0001] The present invention relates to a method of making a circuit board. Background technique [0002] The fine bump pitch of the circuit board is one of the focuses of current application research and development. However, since the exposure alignment accuracy cannot be reduced, the use of solder plated on pad (SPOP) method to form metal bumps on the circuit board or substrate has faced a technical bottleneck. Therefore, a novel manufacturing method is needed to greatly reduce the pitch of the fine bumps. Contents of the invention [0003] The method of the present invention is to provide a circuit board manufacturing method, including the following operations: providing a substrate, the substrate includes a bottom layer and a resin layer, the resin layer is located on the bottom layer, and the resin layer includes a first surface and a second surface opposite to the first surface. surface, the first surface is in contact with the bottom layer; formin...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): H05K3/40
CPCH05K3/4007
Inventor 扈欣祺
Owner UNIMICRON TECH CORP
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