Transceiving assembly
A technology of transceiver components and transceiver cores, applied in the direction of radio wave reflection/re-radiation, utilization of re-radiation, measurement devices, etc., can solve problems such as large size, and achieve the effect of avoiding excessive space occupation
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[0046] As a specific implementation manner of the transceiver assembly provided by the present invention, the first PCB board 210 is a multilayer microwave mixed voltage PCB board. The first PCB board 210 uses a multi-layer mixed-voltage PCB board with high wiring density as the circuit substrate, and the control signal line is routed on the inner layer of the PCB board. The top layer is mainly used to place the highly integrated amplitude-phase multi-function chip 230 and power modulation. Devices such as the chip 240 improve the integration of the components, so that the transceiver components provided by the embodiments of the present invention can be further miniaturized.
[0047] As a specific implementation manner of the transceiver assembly provided by the present invention, the first PCB board 210 is bonded to the diaphragm. Specifically, the first PCB board 210 is bonded to the diaphragm by conductive glue.
[0048] See figure 1 , image 3 and Figure 5 , as a spe...
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