A kind of texture pattern generation method, device, electronic device and readable storage medium
A weaving and warp technology, applied in the field of manufacturing, can solve the problems of low efficiency and accuracy of weaving pattern generation, and achieve the effect of automatic generation
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Embodiment 1
[0031] figure 1 A flowchart showing a method for generating a texture map according to an embodiment of the present invention, such as figure 1 As shown, the method may include the following steps:
[0032] S101: Obtain structural information of the unit structure of the preform to be prepared. Here, the structure information includes the number of warp yarn rows, the number of warp yarn layers, the number of weft yarn rows, the number of weft yarn layers and the positional relationship between warp yarns and weft yarns of the preform unit structure to be prepared.
[0033] In this embodiment, the unit structure of the preform to be prepared is a three-dimensional woven structure. Therefore, the unit structure of the preform to be prepared not only includes multiple columns and multiple layers of warp yarns, but also includes multiple columns and multiple layers of weft yarns. Specifically, Figure 2A and Figure 2B Shown is a three-dimensional woven structure comprising 2 ...
Embodiment 2
[0080] Figure 8 A schematic block diagram of a device for generating a texture graph according to an embodiment of the present invention is shown, and the device can be used to implement the method for generating a texture graph described in Embodiment 1 or any optional implementation thereof. like Figure 8 As shown, the device includes: an information acquisition module 10 , a relationship determination module 20 and a texture graph generation module 30 .
[0081] The information acquiring module 10 is used to acquire the structural information of the unit structure of the prefabricated body to be prepared. In the embodiment of the present invention, the structure information includes the number of warp yarn rows, the number of weft yarn layers, the number of weft yarn rows, the number of warp yarn layers, and the positional relationship between warp yarns and weft yarns of the preform unit structure to be prepared. For details, refer to the relevant description of step S...
Embodiment 3
[0086] An embodiment of the present invention provides an electronic device, such as Figure 10 As shown, the electronic device may include a processor 1001 and a memory 1002, wherein the processor 1001 and the memory 1002 may be connected through a bus or in other ways, Figure 10 Take connection via bus as an example.
[0087] The processor 1001 may be a central processing unit (Central Processing Unit, CPU). The processor 1001 may also be other general-purpose processors, digital signal processors (Digital Signal Processor, DSP), application-specific integrated circuits (Application Specific Integrated Circuit, ASIC), field-programmable gate arrays (Field-Programmable Gate Array, FPGA) or Other chips such as programmable logic devices, discrete gate or transistor logic devices, discrete hardware components, or combinations of the above-mentioned types of chips.
[0088] The memory 1002, as a non-transitory computer-readable storage medium, can be used to store non-transit...
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