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MEMS structure

A substrate and piezoelectric composite technology, applied in the field of MEMS structure, can solve problems such as low sensitivity, achieve high sensitivity, easy implementation, and improve production efficiency.

Pending Publication Date: 2020-05-19
ANHUI ORINFIN ACOUSTIC SCI&TECH CO LTD
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Problems solved by technology

[0004] Aiming at the problem of low sensitivity in related technologies, this application proposes a MEMS structure, which can effectively improve the sensitivity

Method used

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Embodiment Construction

[0027] The following will clearly and completely describe the technical solutions in the embodiments of the application with reference to the drawings in the embodiments of the application. Apparently, the described embodiments are only some of the embodiments of the application, not all of them. All other embodiments obtained by persons of ordinary skill in the art based on the embodiments in this application belong to the protection scope of this application.

[0028] see figure 1 with figure 2 , according to an embodiment of the present application, a MEMS structure is provided. The MEMS structure includes: a substrate 10 with a cavity 12; a piezoelectric composite vibration layer 20 formed directly above the cavity 12; a connector 40 formed above the substrate 10 and connecting the substrate 10 and the piezoelectric composite vibration Layer 20. The MEMS structure reduces the resonance frequency and has high sensitivity. The details of this MEMS structure will be spec...

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Abstract

The invention discloses an MEMS structure, which comprises a substrate with a cavity; a piezoelectric composite vibration layer formed right above the cavity; and a connecting piece formed above the substrate and connected with the substrate and the piezoelectric composite vibration layer. According to the MEMS structure, elastic connection of the substrate and the piezoelectric composite vibration layer is achieved through the connecting piece, low resonant frequency is obtained, and the frequency range is 100-10000 Hz. The MEMS structure works near the resonant frequency, so that high sensitivity is obtained, and an effective awakening effect is achieved. And a manufacturing method is relatively simple in process and easy to implement, and the production efficiency of the product is improved.

Description

technical field [0001] The present application relates to the field of microelectromechanical systems, in particular, to a MEMS (short for MicroelectroMechanical Systems, microelectromechanical systems) structure. Background technique [0002] MEMS microphones (microphones) mainly include two types: capacitive and piezoelectric. MEMS piezoelectric microphone is a microphone prepared by microelectromechanical system technology and piezoelectric thin film technology. Due to the use of semiconductor planar technology and bulk silicon processing technology, it has small size, small volume and good consistency. At the same time, compared with condenser microphones, there are advantages such as no need for bias voltage, wide operating temperature range, dustproof, waterproof, etc., but its sensitivity is relatively low, which restricts the development of MEMS piezoelectric microphones. [0003] For the problem of how to improve the sensitivity of the piezoelectric MEMS structure ...

Claims

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Application Information

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IPC IPC(8): H04R19/04
CPCH04R19/04
Inventor 刘端
Owner ANHUI ORINFIN ACOUSTIC SCI&TECH CO LTD
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