Wafer thinning auxiliary machine for power electronic device chip production

Abstract

The invention discloses a wafer thinning auxiliary machine for power electronic device chip production. The wafer thinning auxiliary machine structurally comprises an equipment body, a working box, atransmission shaft, a control panel, a chip mounting device and a workbench. An anti-static strip, a permeation plate and a fitting ring are matched with air flow which blows outwards, the film at theedge of the wafer is subjected to rotary stroking treatment, is subjected to airflow blowing to reinforce and attach the film to the edge of the wafer to enhance the stress effect of the film and theedge of the wafer and prevent the edge film from upwarping along with the middle film due to small stress to cause that the wafer is damaged in the thinning process; through the cooperation of a stroking and buckling groove plate, a film pasting box and the wafer are subjected to passive correction and coincidence while a buckling mechanism is used for laminating the wafer and pressing the waferdownwards to carry out film lamination, so that the phenomenon that due to the fact that the face of the wafer is smooth and slides under the downward pressing acting force, a film and the wafer are not attached compactly, and bubbles are generated in the film pasting box is avoided.

Description

technical field [0001] The invention relates to the technical field of wafer grinding, more precisely, to a wafer thinning auxiliary machine for power electronic device chip production. Background technique [0002] When the wafer is being thinned, it is necessary to attach a film to the front of the wafer body to prevent the circuit on the front of the wafer from being broken by an external force during the thinning process on the back, which will cause the wafer to be scrapped. Because the thickness of the wafer is relatively thin and the existing diameter is large, when the film is attached, it is easy to appear that after the film is attached, when the wafer box leaves the surface of the wafer film, the film at the edge is relatively weak due to its downward bonding force. The film at the edge tends to warp upwards and detach from the wafer due to poor bonding force in the middle and upward electrostatic suction force. [0003] At the same time, during the process of bo...

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Problems solved by technology

[0004] In view of the deficiencies in the prior art, the purpose of the present invention is to provide a wafer thinning auxiliary machine for power electronic device chip production to solve the problem of the prior art that the wafer is thinner and the existing diameter is larger. When attaching the film, it is easy to appear that after the film is attached, when the wafer box leaves the surface of the wafer attaching film, the film at the edge is inferior to the bonding force of the middle part due to its downward bonding force and the upward electrostatic suction force. The film is prone to warping upwards and detaching from the wafer. During the downward bonding process of the wafer, the wafer is fixed by the lower box, but under the effect of its own smooth surface, and When under the action of external force, there will be a phenomenon of sliding when attaching the film, resulting in incomplete bonding between the film and the wafer surface and the defect of bubbles

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