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A low-cost conductive silver glue for photovoltaic shingled modules and its preparation method

A conductive silver glue, low-cost technology, applied in the field of conductive glue, can solve the problems that affect the competitive advantage of shingled components, adversely affect the power of components, affect the conductivity of silver glue, etc., and achieve long-term reliability advantages, excellent process performance, excellent The effect of bond strength

Active Publication Date: 2021-06-29
成都银盛新材料有限公司
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0004] At present, the shingled conductive adhesives on the market use silver powder as the conductive filler. In order to obtain better conductivity, the silver content is mostly 70-80%, and the cost of raw materials is high, which affects the competitive advantage of shingled components; Reduce the silver content to reduce the cost, but correspondingly affect the conductivity of the silver glue, which will adversely affect the power of the module

Method used

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  • A low-cost conductive silver glue for photovoltaic shingled modules and its preparation method
  • A low-cost conductive silver glue for photovoltaic shingled modules and its preparation method
  • A low-cost conductive silver glue for photovoltaic shingled modules and its preparation method

Examples

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Effect test

Embodiment 1

[0034] A low-cost conductive silver adhesive for photovoltaic shingled modules, consisting of 40% silver powder A, 40% silver nickel powder A, 13% resin A, 6.2% solvent A, 0.5% additive A and 0.3% additive B . The silver-nickel powder A is silver-nickel alloy powder, and the silver content of the silver-nickel alloy powder is 30%, and the D50 particle size is 1.0-3.0um. The resin A is a BMA-BzMA binary resin. The solvent A is a mixed solvent of isobornyl methacrylate and ethylene glycol diacrylate. The auxiliary agent A is Anti-Terra-U100, and the auxiliary agent B is tert-butyl peroxy 2-ethylhexyl acid (TBPO).

[0035] The preparation method of the silver powder A: take 7 parts of monodisperse spherical silver powder purchased in the market, particle size D50 2-5um; take 1 part of commercially available nano-silver powder, particle size D50 300-500nm. Take 0.1 part of polyoxyether dispersant and dissolve it in 80 parts of isopropanol, add silver powder and stir to mix. Th...

Embodiment 2

[0037] A low-cost conductive silver adhesive for photovoltaic shingled modules, consisting of 40% silver powder A, 40% silver nickel powder B, 13% resin A, 6.2% solvent A, 0.5% additive A and 0.3% additive B . The silver-nickel powder B is silver-coated nickel powder, the silver content of the silver-coated nickel powder is 30%, and the D50 particle size is 1.0-2.0um. The resin A is a BMA-BzMA binary resin. The solvent A is a mixed solvent of isobornyl methacrylate and ethylene glycol diacrylate. The auxiliary agent A is Anti-Terra-U100, and the auxiliary agent B is tert-butyl peroxy 2-ethylhexyl acid (TBPO).

[0038] The preparation method of the silver powder A: take 7 parts of monodisperse spherical silver powder purchased in the market, particle size D50 2-5um; take 1 part of commercially available nano-silver powder, particle size D50 300-500nm. Take 0.1 part of polyoxyether dispersant and dissolve it in 80 parts of isopropanol, add silver powder and stir to mix. Then...

Embodiment 3

[0040] A low-cost conductive silver adhesive for photovoltaic shingled modules, consisting of 40% silver powder A, 40% silver nickel powder C, 13% resin A, 6.2% solvent A, 0.5% additive A and 0.3% additive B . The silver-nickel powder C is a silver-coated silver-nickel alloy powder, 20% silver is used to coat the silver-nickel alloy powder containing 30% silver, and the D50 particle size is 1.5-4.5um. The resin A is a BMA-BzMA binary resin. The solvent A is a mixed solvent of isobornyl methacrylate and ethylene glycol diacrylate. The auxiliary agent A is Anti-Terra-U100, and the auxiliary agent B is tert-butyl peroxy 2-ethylhexyl acid (TBPO).

[0041] The preparation method of the silver powder A: take 7 parts of monodisperse spherical silver powder purchased in the market, particle size D50 2-5um; take 1 part of commercially available nano-silver powder, particle size D50 300-500nm. Take 0.1 part of polyoxyether dispersant and dissolve it in 80 parts of isopropanol, add si...

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Abstract

The invention discloses a low-cost conductive silver glue for photovoltaic shingled components and a preparation method thereof. The conductive silver glue includes 30wt%-50wt% modified silver powder, 30wt%-50wt% silver-nickel powder, the silver-nickel The powder is any one or more of silver-nickel alloy powder, silver-coated nickel powder, and silver-coated silver-nickel alloy powder. The invention adopts polyoxyether dispersant to modify monodisperse spherical silver powder and nanometer silver powder to prepare modified silver powder. The present invention further reduces the amount of silver powder on the basis of ensuring the performance of the conductive silver glue, and reduces the cost by about 20%; at the same time, the prepared conductive silver glue has excellent bonding strength, and the bonding strength after curing is much greater than the strength of the silicon wafer. The tensile strength is greater than 2MPa. The invention improves the activity of the silver powder through the modification of the silver powder, and the prepared conductive silver glue has excellent process performance, and the glue can be glued continuously for more than 2 hours, and the glue line is clear and uniform.

Description

technical field [0001] The invention belongs to the technical field of conductive glue, and in particular relates to a low-cost conductive silver glue used in photovoltaic shingled components and a preparation method thereof. Background technique [0002] Solar energy is a green and inexhaustible energy source. It is an important development direction for human beings to replace conventional oil and gas energy. Solar cells are an important way of photoelectric conversion. Currently relatively mature is the crystalline silicon solar cell, which accounts for more than 90% of the share of photovoltaic power generation. In order to improve the photoelectric conversion efficiency of crystalline silicon solar cells, researchers hope to increase the module power as much as possible under the same cell module area, so as to reduce transportation costs and installation costs. Therefore, the shingled module came into being, that is, the large battery slices used in the past are cut i...

Claims

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Application Information

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Patent Type & Authority Patents(China)
IPC IPC(8): H01B1/22H01B13/00H01L31/0224
CPCH01B1/22H01B13/00H01L31/022425Y02E10/50
Inventor 包卫锋
Owner 成都银盛新材料有限公司
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