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Three-layer wafer bonding alignment equipment and bonding method

A technology for alignment equipment and wafer bonding, applied in electrical components, semiconductor/solid-state device manufacturing, circuits, etc., can solve the problems of complex structure, inconvenient operation, long completion time, etc., to simplify the bonding steps and reduce production. cost, efficiency

Pending Publication Date: 2020-05-29
SHANGHAI IND U TECH RES INST
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0003] At present, the conventional wafer bonding equipment can only realize the bonding of two wafers at a time, and cannot directly complete the precise alignment and bonding of three-layer wafers. Two times to complete the bonding of three wafers, first complete the bonding of two wafers, and then bond with the third wafer
Because the bonding surface contact equipment is polluted, it is necessary to clean the bonded two-layer wafer before bonding with the third-layer wafer, which increases the cleaning cost. Introduce some additional defects
[0004] Recently, a three-layer wafer bonding alignment equipment has also appeared, which can align three-layer wafers at the same time, so as to realize the bonding of three-layer wafers at one time, but the spacer mechanism of this alignment equipment is composed of multiple Composed of a single-layer spacer mechanism, the structure is complex and the operation is inconvenient

Method used

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  • Three-layer wafer bonding alignment equipment and bonding method
  • Three-layer wafer bonding alignment equipment and bonding method
  • Three-layer wafer bonding alignment equipment and bonding method

Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1

[0034] Such as Figure 1-2 As shown, a wafer bonding alignment device 1 is capable of aligning and fixing three-layer wafers thereon, so that three-layer wafers can be bonded at one time. The alignment device 1 includes a main body 2 and a spacer mechanism 3 and a fixing mechanism 4 arranged on the main body 2. The main body 2 is in the shape of a circular ring, and three vacuum suction heads 5 protrude from the circular ring. The three vacuum suction heads 5 It is symmetrically arranged on the inner side of the ring at an interval of 120°. The vacuum suction head 5 is provided with vacuum suction holes for adsorbing and fixing the first layer of wafers on the surface of the vacuum suction head 5. The vacuum suction head 5 is also connected with the fixing mechanism. 4 cooperate to clamp the three-layer wafer between the two.

[0035] The alignment device 1 includes three spacer mechanisms 3 and three fixing mechanisms 4, the three spacer mechanisms 3 and the three fixing mec...

Embodiment 2

[0040] Such as Figure 3-5 As shown, a spacer mechanism 3 for wafer bonding alignment equipment 1 includes a linear drive part 7 and a double-layer spacer part 6, and the linear drive part 7 drives the double-layer spacer part 6 along the The linear reciprocating motion is carried out along the radial direction of the ring of the body 2, thereby completing the action of inserting and withdrawing the two-layer spacer into and out of the three-layer wafer. The linear drive part 7 includes a mounting seat 8 , a waist-shaped hole seat 9 , a lever 10 and a tension spring 11 , and the double-layer separator part 6 is fixedly arranged on the mounting seat 8 above the upper surface of the body 2 . The mounting seat 8 is slidably arranged in the through hole 12 of the body 2. Specifically, a bracket 16 is set in the through hole 12, and the bracket 16 is detachably fixed on the body 2. The extended guide rail 13, one side of the mounting seat 8 is provided with a slider 14 that slides...

Embodiment 3

[0044] Such as image 3 , 4 As shown in and 6, a fixing mechanism 4 for wafer bonding and alignment equipment 1 includes a clamping jaw 20 and an opening and closing driving part 21, and the opening and closing driving part 21 drives the clamping jaws 20 to press down or Tilt upwards, and when pressing downwards, the free end 20A of the jaws 20 is pressed against the third-layer wafer, cooperates with the upper surface of the vacuum suction head 5 to clamp the three-layer wafers between the two, and upwards When lifting, the free end 20A of the jaw 20 leaves the third-layer wafer upwards, releasing the third-layer wafer. In this embodiment, the free end 20A of the clamping jaw 20 is provided with a pressure roller 23 , and the pressure roller 23 is pressed against the surface of the third wafer when pressed downward.

[0045] The middle part of jaw 20 is rotatably arranged on the support 16 by rotating shaft 2 24, and support 16 is detachably fixed in the through hole 12 of ...

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Abstract

The invention provides three-layer wafer bonding alignment equipment and a method for performing three-layer wafer bonding by using the alignment equipment. The alignment equipment comprises a body, isolation sheet mechanisms and a fixing mechanism, the isolation sheet mechanisms and the fixing mechanism are arranged on the body, each isolation sheet mechanism comprises two layers of isolation sheets, a gap is formed between the two layers of isolation sheets, and the multiple isolation sheet mechanisms can clamp a wafer through closed ends of the gaps. Each isolation sheet mechanism has a limiting and fixing effect on the wafer located between the two layers of isolation sheets. The equipment is simple in structure and convenient to operate. Bonding steps are simplified so that the alignment equipment can complete alignment and fixation of three layers of wafers at a time, and can directly complete bonding of the three layers of wafers at a time without increasing too much cost. Efficiency is improved, and production cost is reduced.

Description

technical field [0001] The invention belongs to the field of semiconductor integrated circuit manufacturing, and in particular relates to an alignment device and a bonding method for three-layer wafer bonding. Background technique [0002] In the manufacturing process of semiconductor devices, in order to realize the miniaturization, multi-function and high performance of devices, it is often necessary to bond multiple wafers together. According to different application fields, the process equipment and parameters of wafer bonding are different, but the basic principles are similar, mainly including processes such as vacuuming, heating, applying pressure, releasing pressure, and cooling to break the vacuum. Usually, a complete set of wafer bonding equipment mainly consists of two types of equipment: alignment equipment and bonding equipment. The alignment equipment can align the two wafers according to the alignment marks, insert the spacer, and fix the two wafers. Generall...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): H01L21/67H01L21/68
CPCH01L21/67092H01L21/68H01L21/681
Inventor 李盈
Owner SHANGHAI IND U TECH RES INST