A packaging module and packaging method for a power semiconductor device
A technology of power semiconductors and packaging methods, which is applied in the direction of semiconductor devices, semiconductor/solid-state device manufacturing, semiconductor/solid-state device components, etc., can solve problems such as high packaging costs and complex packaging processes for intelligent power modules, and achieve reduced packaging costs, The effect of simplifying the packaging process
Active Publication Date: 2021-11-16
GREE ELECTRIC APPLIANCES INC +1
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Problems solved by technology
[0004] The main purpose of the present invention is to provide a packaging module and packaging method for power semiconductor devices to solve the problems of complex packaging process and high packaging cost of intelligent power modules in the prior art
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[0033] It should be noted that, in the case of no conflict, the embodiments in the present application and the features in the embodiments can be combined with each other. The present invention will be described in detail below with reference to the accompanying drawings and examples.
[0034] It should be pointed out that the following detailed description is exemplary and intended to provide further explanation to the present application. Unless defined otherwise, all technical and scientific terms used herein have the same meaning as commonly understood by one of ordinary skill in the art to which this application belongs.
[0035] It should be noted that the terminology used here is only for describing specific implementations, and is not intended to limit the exemplary implementations according to the present application. As used herein, unless the context clearly indicates otherwise, the singular form is also intended to include the plural form. In addition, it should a...
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The invention provides a packaging module and a packaging method of a power semiconductor device. The packaging module includes a first-level packaging module, and the first-level packaging module includes: a metal heat-conducting layer, with one or more heat dissipation columns arranged at intervals and a connection portion connected to the heat dissipation column, the connection portion and the heat dissipation column are integrally arranged, and the heat dissipation column is opposite to the connection. The part protrudes toward the first direction; the power semiconductor device is arranged on the surface of the metal heat conduction layer opposite to the first direction; the insulating protection layer is covered on the power semiconductor device, and the insulating protection layer has connection holes; and leads The pin is electrically connected to the power semiconductor device through the connection hole. In the first-level packaging module, not only the packaging of the power semiconductor device is realized, but also the heat dissipation is realized, and the function output of the power semiconductor device is realized by using the pin passing through the connection hole. The primary packaging module is suitable for packaging power semiconductor devices with various structures, which can simplify the packaging process of power semiconductor devices and reduce costs.
Description
technical field [0001] The present invention relates to the technical field of packaging of power semiconductor devices, in particular to a packaging module and a packaging method of power semiconductor devices. Background technique [0002] With the advancement of technology and the development of society, the consumption of electricity is increasing. In order to achieve green and sustainable development, the demand for power electronic devices is also increasing, and power semiconductor devices have become mainstream devices in the field of power electronics today. , is the key device for weak current to control strong current. Widely used in various power control circuits, drive circuits and other circuits. Especially in various frequency conversion motors, photovoltaic inverters and smart grids, new energy vehicles, electric locomotive traction drives and other fields have an irreplaceable role. [0003] Compared with traditional discrete power semiconductor devices, s...
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IPC IPC(8): H01L23/31H01L23/367H01L21/50H01L21/56
CPCH01L21/50H01L21/56H01L23/3107H01L23/367
Inventor 曾丹史波葛孝昊赵家宽陈茂麟肖婷
Owner GREE ELECTRIC APPLIANCES INC