Three-dimensional ceramic-based circuit board

Abstract

The invention discloses a three-dimensional ceramic-based circuit board. The three-dimensional ceramic-based circuit board comprises a ceramic substrate; a longitudinal heat dissipation through hole for ventilation and heat dissipation is formed in the middle of the ceramic substrate in the longitudinal direction of the ceramic substrate; a plurality of inwardly recessed grooves are formed in thesurface of the peripheral side of the ceramic substrate; metal coating parts for coating metal are formed between every two adjacent inwardly recessed grooves; metal circuit layers coat on the metal coating parts; and power supply connecting circuit layers which are connected with the metal circuit layers and are used for connecting a power supply are arranged on the front side and the rear side of the ceramic substrate. According to the three-dimensional ceramic-based circuit board of the invention, the plurality of metal coating parts are formed through the plurality of inwardly recessed grooves; when the metal coating parts are provided with the metal circuit layers and the front side and the rear side of the ceramic substrate 1 are provided with the power supply connecting circuit layers which are connected with the metal circuit layers and are used for connecting the power supply, the conduction of circuits can be realized; in addition, hollow ventilation can be achieved through the longitudinal heat dissipation through hole, so that the whole cooling and heat dissipation effect of the ceramic substrate is improved, and an actual use requirement is met.

Description

【Technical field】 [0001] The present application relates to the technical field of PCB, in particular to a three-dimensional ceramic-based circuit board. 【Background technique】 [0002] At present, with the gradual deepening of electronic technology in various application fields, highly integrated circuit boards have become an inevitable trend. Highly integrated package modules require a good heat dissipation carrying system, while traditional circuit boards FR-4 and CEM-3 are used in TC ( The disadvantage of thermal conductivity) has become a bottleneck restricting the development of electronic technology. [0003] The LED industry, which has developed rapidly in recent years, has also put forward higher requirements for the TC index of its load-carrying circuit boards. In the field of high-power LED lighting, materials with good heat dissipation properties such as metal and ceramics are often used to prepare circuit substrates. The thermal conductivity of high thermal con...

AI Technical Summary

Problems solved by technology

[0004] However, most of the existing ceramic circuit boards are planar circuit boards, which cannot meet the actual demand for three-dimensional circuit boards. Therefore, those skilled in the art urgently need to develop a three-dimensional ceramic-based circuit board.

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