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Manufacturing method of high-thermal-conductivity flexible circuit board suitable for three-dimensional space and circuit board

A flexible circuit board, three-dimensional space technology, applied in printed circuit manufacturing, printed circuits, manufacturing printed circuit precursors, etc., can solve problems such as lack of individualization, and achieve the effect of improving production efficiency, high feasibility, and taking into account production costs

Active Publication Date: 2020-06-02
KINWONG ELECTRONICS TECH LONGCHUAN
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  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

The use of LEDs is attached to the circuit board, and the conventional circuit board is flat, similar in appearance, and lacks individuality

Method used

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  • Manufacturing method of high-thermal-conductivity flexible circuit board suitable for three-dimensional space and circuit board
  • Manufacturing method of high-thermal-conductivity flexible circuit board suitable for three-dimensional space and circuit board

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Embodiment Construction

[0030] The technical solutions in the embodiments of the present invention will be clearly and completely described below in conjunction with the drawings in the embodiments of the present invention, and similar component numbers in the drawings represent similar components. Apparently, the embodiments described below are only a part of the embodiments of the present invention, rather than all the embodiments. Based on the embodiments of the present invention, all other embodiments obtained by persons of ordinary skill in the art without creative efforts fall within the protection scope of the present invention.

[0031] It should be understood that when used in this specification and the appended claims, the terms "comprising" and "comprises" indicate the presence of described features, integers, steps, operations, elements and / or components, but do not exclude one or Presence or addition of multiple other features, integers, steps, operations, elements, components and / or col...

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Abstract

The invention discloses a manufacturing method of a high-thermal-conductivity flexible circuit board suitable for a three-dimensional space and the circuit board, and relates to the technical field ofcircuit board manufacturing methods. The manufacturing method comprises the steps of manufacturing a boss on a copper base, and carrying out browning treatment; forming a first window in the FPC pasted with a prepreg, wherein the position of the first window corresponds to the position of the boss, and the size of the first window is 0.03-0.2mm larger than that of the boss; removing a protectivefilm on the prepreg, pressing the FPC pasted with the prepreg and the copper base according to the position sequence of the FPC-prepreg-copper base, and the boss is located in the first window and does not intersect with the FPC; and cutting excessive glue, and carrying out antioxidant treatment on the exposed surface of the copper base. According to the technical scheme, the operability of product production is met, the production cost of the product is considered at the same time, and the feasibility is high. The circuit board provided by the invention has high flexibility and high thermalconductivity, and is suitable for an installation mode of the three-dimensional space.

Description

technical field [0001] The invention relates to the technical field of circuit board production, in particular to a method for manufacturing a highly thermally conductive flexible circuit board suitable for three-dimensional space and the circuit board. Background technique [0002] Metal-based printed circuit boards have good thermal conductivity (the thermal conductivity of metal copper is 400W / m.k), so metal-based printed circuit boards are often used in high-power, high-heat dissipation products. However, because the material is copper or aluminum, which has strong rigidity, it is mostly used in flat products, and it is difficult to be used in three-dimensional space. [0003] With the advancement of technology, automotive lighting has been upgraded from traditional halogen lamps to xenon lamps. In recent years, LED technology has developed rapidly, and LED lighting has a tendency to replace xenon lamps. The use of LEDs is attached to circuit boards. Conventional circui...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): H05K3/02H05K3/38
CPCH05K3/022H05K3/385
Inventor 刘玮罗奇张飞龙
Owner KINWONG ELECTRONICS TECH LONGCHUAN
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