A kind of profiling foil-shaped sandwich solder for aluminum honeycomb plate brazing and preparation method thereof
An aluminum honeycomb, sandwich technology, applied in welding equipment, welding/cutting media/materials, manufacturing tools, etc., can solve the problems of turbulent flow of solder, low efficiency and waste of Al-Si solder foil brazing, and achieve improvement. Plasticity, the effect of improving the mechanical properties of the joint
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[0033] The preparation method of the present invention comprises the following steps:
[0034] 1) Take two aluminum foils 1 of the same size and weigh them, and calculate the mass of the Ga-In-Sn ternary liquid alloy and the mass of silicon powder according to the mass ratio and the mass of the two aluminum foils 1;
[0035] 2) According to the calculation in step 1), weigh the corresponding mass of Ga-In-Sn ternary liquid alloy and silicon powder, add the silicon powder into the Ga-In-Sn ternary liquid alloy, stir evenly to make a sandwich paste 3 ;
[0036] 3) First, evenly brush the sandwich paste 3 obtained in step 2) on the surface of one side of one aluminum foil 1 in step 1), and then cover the other aluminum foil 1 on the sandwich paste 3 layer, to obtain interlayer aluminum foil 1;
[0037] 4) On the interlayer aluminum foil 1 obtained in step 3), the through holes 2 are cut on the interlayer aluminum foil 1 by a laser cutting machine, and a plurality of through hol...
Embodiment 1
[0040] The aluminum honeycomb plate brazing of the present embodiment is used for profiling foil-shaped sandwich solder component formula: the main component of the solder is Al-Si eutectic, and also includes Ga-In-Sn ternary liquid alloy, and the components of each component are The mass percentage is 91% Al-Si binary eutectic, 9% Ga-In-Sn ternary liquid alloy.
[0041] Preparation:
[0042] 1) Take two pieces of pure aluminum foil 1 with a certain size, and calculate the Ga-In-Sn ternary liquid alloy and Si powder that should be added by the weight of the aluminum foil 1;
[0043] 2) Add Si powder into Ga-In-Sn ternary liquid alloy, stir to make sandwich paste 3;
[0044] 3) Evenly brush the sandwich paste 3 on the surface of one of the aluminum foils 1, and completely cover it with the other aluminum foil 1 to obtain the interlayer aluminum foil 1;
[0045] 4) Fix the interlayer aluminum foil 1 obtained in step 3), and process it into honeycomb-shaped profiling foil-shape...
Embodiment 2
[0047] The profiling foil-shaped sandwich solder component formula for aluminum honeycomb plate brazing of the present invention: the main component of the solder is Al-Si eutectic, and also includes Ga-In-Sn ternary liquid alloy, and the mass of each component is The percentage is 92% Al-Si binary eutectic, 8% Ga-In-Sn ternary liquid alloy.
[0048] Preparation method: the same preparation method as in Example 1, the melting point of the solder is 480°C to 485°C.
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