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Profiling foil-shaped sandwich brazing filler metal for aluminum cellular board brazing and preparation method of profiling foil-shaped sandwich brazing filler metal

An aluminum honeycomb and sandwich technology, which is applied to welding equipment, welding/cutting media/materials, welding media, etc., can solve the problems of turbulent flow, waste of solder, and low efficiency of Al-Si solder foil brazing, etc. Turbulent solder flow, saving solder, high brazing efficiency

Active Publication Date: 2020-06-09
ZHENGZHOU RES INST OF MECHANICAL ENG CO LTD
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0005] The present invention aims to provide a profiling foil-shaped sandwich solder for aluminum honeycomb plate brazing and its preparation method, thereby effectively solving the problems of low brazing efficiency, turbulent flow of solder and serious waste of the existing Al-Si solder foil

Method used

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  • Profiling foil-shaped sandwich brazing filler metal for aluminum cellular board brazing and preparation method of profiling foil-shaped sandwich brazing filler metal
  • Profiling foil-shaped sandwich brazing filler metal for aluminum cellular board brazing and preparation method of profiling foil-shaped sandwich brazing filler metal
  • Profiling foil-shaped sandwich brazing filler metal for aluminum cellular board brazing and preparation method of profiling foil-shaped sandwich brazing filler metal

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preparation example Construction

[0033] The preparation method of the present invention comprises the following steps:

[0034] 1) Take two aluminum foils 1 of the same size and weigh them, and calculate the mass of the Ga-In-Sn ternary liquid alloy and the mass of silicon powder according to the mass ratio and the mass of the two aluminum foils 1;

[0035] 2) According to the calculation in step 1), weigh the corresponding mass of Ga-In-Sn ternary liquid alloy and silicon powder, add the silicon powder into the Ga-In-Sn ternary liquid alloy, stir evenly to make a sandwich paste 3 ;

[0036] 3) First, evenly brush the sandwich paste 3 obtained in step 2) on the surface of one side of one aluminum foil 1 in step 1), and then cover the other aluminum foil 1 on the sandwich paste 3 layer, to obtain interlayer aluminum foil 1;

[0037] 4) On the interlayer aluminum foil 1 obtained in step 3), the through holes 2 are cut on the interlayer aluminum foil 1 by a laser cutting machine, and a plurality of through hol...

Embodiment 1

[0040] The aluminum honeycomb plate brazing of the present embodiment is used for profiling foil-shaped sandwich solder component formula: the main component of the solder is Al-Si eutectic, and also includes Ga-In-Sn ternary liquid alloy, and the components of each component are The mass percentage is 91% Al-Si binary eutectic, 9% Ga-In-Sn ternary liquid alloy.

[0041] Preparation:

[0042] 1) Take two pieces of pure aluminum foil 1 with a certain size, and calculate the Ga-In-Sn ternary liquid alloy and Si powder that should be added by the weight of the aluminum foil 1;

[0043] 2) Add Si powder into Ga-In-Sn ternary liquid alloy, stir to make sandwich paste 3;

[0044] 3) Evenly brush the sandwich paste 3 on the surface of one of the aluminum foils 1, and completely cover it with the other aluminum foil 1 to obtain the interlayer aluminum foil 1;

[0045] 4) Fix the interlayer aluminum foil 1 obtained in step 3), and process it into honeycomb-shaped profiling foil-shape...

Embodiment 2

[0047] The profiling foil-shaped sandwich solder component formula for aluminum honeycomb plate brazing of the present invention: the main component of the solder is Al-Si eutectic, and also includes Ga-In-Sn ternary liquid alloy, and the mass of each component is The percentage is 92% Al-Si binary eutectic, 8% Ga-In-Sn ternary liquid alloy.

[0048] Preparation method: the same preparation method as in Example 1, the melting point of the solder is 480°C to 485°C.

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Abstract

The invention relates to the technical field of aluminum cellular board brazing, in particular to profiling foil-shaped sandwich brazing filler metal for aluminum cellular board brazing and a preparation method of the profiling foil-shaped sandwich brazing filler metal. The profiling foil-shaped sandwich brazing filler metal comprises Al-Si binary eutectic and a Ga-In-Sn ternary liquid alloy, themass percent of the Al-Si binary eutectic ranges from 91% to 95%, the Ga-In-Sn ternary liquid alloy serves as the balance, and the component mass ratio of the Ga-In-Sn ternary liquid alloy is Ga:In:Sn=(67-69.5):(20-22.2):(9-11). The brazing filler metal comprises two layers of aluminum foil and sandwich paste arranged between the two layers of aluminum foil and sandwich in a sandwich manner, and multiple through holes are formed in the brazing filler metal at intervals. By means of the profiling foil-shaped sandwich brazing filler metal, the problems that the brazing efficiency of existing Al-Si brazing filler metal foil is low, brazing filler metal flows disorderedly, and waste is severe can be effectively solved.

Description

technical field [0001] The invention relates to the technical field of brazing of aluminum honeycomb panels, in particular to a profiling foil-shaped sandwich solder for brazing of aluminum honeycomb panels and a preparation method thereof. Background technique [0002] The brazed aluminum alloy honeycomb panel has a series of advantages such as light weight, high strength, high rigidity, good stability, heat insulation and sound insulation, and is not limited by adhesives. It has been gradually used in rail transit, construction, ships, aircraft, etc. in the field. The commonly used aluminum alloys of the existing aluminum alloy honeycomb panels are 3 series aluminum alloys. The 3-series aluminum alloy cannot be strengthened by heat treatment, so its strength after brazing is limited. "Lightweight, high performance, safety, environmental protection and energy saving" is an inevitable trend in the development of transportation and construction industries, so newer and high...

Claims

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Application Information

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IPC IPC(8): B23K35/02B23K35/28B23K35/40
CPCB23K35/0238B23K35/288B23K35/40
Inventor 董显纠永涛程亚芳裴夤崟黄俊兰王路乙李文彬王蒙
Owner ZHENGZHOU RES INST OF MECHANICAL ENG CO LTD
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