A kind of surface metallization and brazing method for electronic packaging composite material

A surface metal and composite material technology, applied in metal processing equipment, metal material coating technology, welding equipment, etc., can solve the problems of induced cracks, easy oxidation cost, easy oxidation of Al-based solder, etc., and reduce the thermal expansion coefficient Difference, effect of improving brazing strength and improving brazing efficiency

Active Publication Date: 2020-02-07
江苏虹普电子材料科技有限公司
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

Compared with the present application, the above-mentioned solders are easy to oxidize Al-based solders, the welding temperature of Sn-based solders is too low, and the cost of Ag-based solders is relatively high, which has great limitations in use.
[0006] In summary, compared with this application, the above brazing process or solder selection can achieve high volume fraction SiC p Brazing of / Al composite materials, but the thermal expansion coefficient between the Ni layer and the substrate does not match, the interface bonding force is not strong and other defects, and cracks are easily induced at the interface after welding. In addition, various restrictions of the metal solder (high welding temperature, high welding temperature, Easy to oxidize or high cost, etc.) have become the main factors limiting the application of such methods

Method used

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  • A kind of surface metallization and brazing method for electronic packaging composite material
  • A kind of surface metallization and brazing method for electronic packaging composite material
  • A kind of surface metallization and brazing method for electronic packaging composite material

Examples

Experimental program
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Effect test

Embodiment example 1

[0045] (1) Commercially available nickel sulfate, sodium hypophosphite, trisodium citrate, sodium acetate and lactic acid are mixed with 25g / L, 30g / L, 20g / L, 15g / L and 30g / L concentration respectively, then Add 3g / L of SiC particles to configure a Ni-P-SiC plating solution with a pH of 4.

[0046] (2) High volume fraction SiC p / Al composite material is first degreased by acetone, and placed in 50ml / L HCl+25g / LSnCl 2 Sensitized in the solution, and then put with 25ml / L HCl+0.25g / L PdCl 2 Activated in the solution, rinsed with deionized water and placed in the composite plating solution configured in (1). Finally, it was placed in a magnetic stirring water bath for composite plating, the temperature was adjusted to 80°C, and the plating time was 60 minutes.

[0047] (3) Take commercially available low melting SnO-ZnO-P 2 o 5 Glass solder, plus an appropriate amount of terpineol + ethyl cellulose solution (terpineol: ethyl cellulose: low melting SnO-ZnO-P 2 o 5 Glass sold...

Embodiment example 2

[0050] (1) Commercially available nickel sulfate, sodium hypophosphite, trisodium citrate, sodium acetate and lactic acid are mixed with 25g / L, 30g / L, 20g / L, 15g / L and 30g / L concentration respectively, then Add 3g / L of SiC particles to configure a Ni-P-SiC plating solution with a pH of 4.

[0051] (2) High volume fraction SiC p / Al composite material is first degreased by acetone, and placed in 50ml / L HCl+25g / LSnCl 2 Sensitized in the solution, and then put with 25ml / L HCl+0.25g / L PdCl 2 Activated in the solution, rinsed with deionized water and placed in the composite plating solution configured in (1). Finally, it was placed in a magnetically stirred water bath for composite plating, the temperature was adjusted to 90° C., and the plating time was 30 minutes.

[0052] (3) Take commercially available low melting SnO-ZnO-P 2 o 5 Glass solder, plus an appropriate amount of terpineol + ethyl cellulose solution (terpineol: ethyl cellulose: low melting SnO-ZnO-P 2 o 5 Glass...

Embodiment example 3

[0055] (1) Commercially available nickel sulfate, sodium hypophosphite, trisodium citrate, sodium acetate and lactic acid are mixed with 25g / L, 30g / L, 20g / L, 15g / L and 30g / L concentration respectively, then Add 3g / L SiC particles to configure a Ni-P-SiC plating solution with a pH of 6.

[0056] (2) Put the high volume fraction SiCp / Al composite material in 50ml / L HCl+25g / LSnCl 2 Sensitized in the solution, and then put with 25ml / L HCl+0.25g / L PdCl 2 Activated in the solution, rinsed with deionized water and placed in the composite plating solution configured in (1). Finally, it was placed in a magnetically stirred water bath for composite plating, the temperature was adjusted to 90° C., and the plating time was 15 minutes.

[0057] (3) Take commercially available low melting SnO-ZnO-P 2 o 5 Glass solder, plus an appropriate amount of terpineol + ethyl cellulose solution (terpineol: ethyl cellulose: low melting SnO-ZnO-P 2 o 5 Glass solder = 9g: 1g: 10g), after fully stir...

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Abstract

The invention belongs to the technical field of welding, and relates to a surface metallizing and brazing method of a high-volume-fraction SiCp / Al composite. Through a reasonable process, a Ni-P-SiC composite coating is obtained, by adding SiC particles into the coating, the thermal expansion coefficient difference between a substrate and the coating can be effectively reduced, the binding force of the coating can be properly improved, and in addition, compared with the mode that nickel plating is only conducted on the upper surface of the SiCp / Al composite for welding, the brazing strength can be improved to a certain degree by adding the SiC particles into the coating. Low-melting glass brazing alloy (namely SnO-ZnO-P2O5 glass brazing alloy) and SiC ceramic have good wettability, the requirement for oxygen partial pressure of the welding condition is low when glass is used as brazing alloy, the brazing efficiency can be effectively improved, the cost is reduced, and thus, by combing surface metallizing with the brazing process, good brazing joints can be obtained and can meet the requirement for application in the electronic packaging field.

Description

technical field [0001] The present invention belongs to high volume fraction SiC p Welding of Al / Al composites involving a high volume fraction SiC p / Al composite material surface metallization and brazing method. Background technique [0002] High volume fraction SiC p / Al composites have been widely used in the automotive, aerospace, and electronics industries due to their high thermal conductivity, high strength, good wear resistance, and adjustable coefficient of expansion (CTE). Despite the excellent performance, the presence of high volume fraction SiC particles in the composite and the oxide film on the surface of the aluminum matrix seriously hinders the wetting and spreading of the solder on the base metal, thereby affecting the brazing performance of the base material. [0003] In response to this problem, many researchers choose to use SiC p Electroless nickel plating on the surface of / Al composite material, such as Chinese patent ZL201110259096.X "A process...

Claims

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Application Information

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Patent Type & Authority Patents(China)
IPC IPC(8): B23K1/00B23K1/008B23K1/20C23C18/50
CPCB23K1/0008B23K1/008B23K1/20B23K1/206C23C18/50
Inventor 刘桂武张相召乔冠军骆文强刘磊邵海成徐紫巍王明松
Owner 江苏虹普电子材料科技有限公司
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