Bulk acoustic wave resonator with heat dissipation structure and manufacturing process

A technology of bulk acoustic wave resonator and heat dissipation structure, which is applied in the field of communication devices, can solve the problems that bulk acoustic wave resonators do not have heat dissipation effect and electromagnetic shielding effect, achieve good heat dissipation and anti-electromagnetic shielding effect, improve performance, and be good and reliable sexual effect

Active Publication Date: 2020-06-09
HANGZHOU JWL TECH INC
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  • Abstract
  • Description
  • Claims
  • Application Information

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Problems solved by technology

[0005] In view of the problems mentioned above that the bulk acoustic wave resonator does not have the effect of heat dissipation and electromagnetic shielding

Method used

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  • Bulk acoustic wave resonator with heat dissipation structure and manufacturing process
  • Bulk acoustic wave resonator with heat dissipation structure and manufacturing process
  • Bulk acoustic wave resonator with heat dissipation structure and manufacturing process

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Embodiment Construction

[0046] The present application will be further described in detail below with reference to the accompanying drawings and embodiments. It should be understood that the specific embodiments described herein are only used to explain the related invention, but not to limit the invention. In addition, it should be noted that, for the convenience of description, only the parts related to the related invention are shown in the drawings. It should be noted that the dimensions and dimensions of components in the drawings are not to scale and the size of some components may be highlighted for clarity.

[0047] It should be noted that the embodiments in the present application and the features of the embodiments may be combined with each other in the case of no conflict. The present application will be described in detail below with reference to the accompanying drawings and in conjunction with the embodiments.

[0048] The present invention provides a bulk acoustic wave resonator with...

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Abstract

The invention discloses a bulk acoustic wave resonator with a heat dissipation structure and a manufacturing process. The bulk acoustic wave resonator comprises a substrate, a metal heat dissipation layer formed on the substrate and provided with an insulating layer on the surface, and a resonance function layer formed on the insulating layer. The metal heat dissipation layer and the insulating layer surround the substrate to form a cavity, and a bottom electrode layer in the resonance function layer covers the cavity. The metal heat dissipation layer and metal columns are arranged around thecavity, so that heat can be conducted out in time in the use process of the device, and the service life of the device is prolonged. According to the bulk acoustic wave resonator, the metal heat dissipation layer, the bottom electrode layer and a top electrode layer are prevented from forming capacitance as much as possible structurally, parasitic capacitance of the resonator is reduced, and performance of the resonator is effectively improved. Moreover, the device can also have an electromagnetic shielding structure, so that the device has good heat dissipation and anti-electromagnetic shielding effects in the use process on the premise of reducing parasitic capacitance of the resonator, and the device has good reliability while working normally and stably.

Description

technical field [0001] The present application relates to the field of communication devices, and mainly relates to a bulk acoustic wave resonator with a heat dissipation structure and a manufacturing process thereof. Background technique [0002] With the increasingly crowded electromagnetic spectrum and the increase in frequency bands and functions of wireless communication equipment, the electromagnetic spectrum used in wireless communication has grown rapidly from 500MHz to above 5GHz, which also requires high performance, low cost, low power consumption and small size of RF front-end modules. growing. The filter is one of the RF front-end modules, which is mainly composed of multiple resonators connected through a topology network structure, which can improve the transmitted signal and the received signal. Fbar (Thin film bulk acoustic resonator) is a bulk acoustic wave resonator. The filter composed of Fbar has the advantages of small size, strong integration ability,...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): H03H3/02H03H3/04H03H9/02H03H9/17
CPCH03H3/02H03H3/04H03H9/02102H03H9/02125H03H9/02086H03H9/174H03H2003/023H03H2003/0407Y02D30/70H03H9/173H03H2003/021H03H9/131H03H9/133H03H9/54
Inventor 李林萍盛荆浩江舟
Owner HANGZHOU JWL TECH INC
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