Heat dissipation and welding offset prevention packaging structure of PCB and design method of heat dissipation and welding offset prevention packaging structure

A technology of packaging structure and design method, which is applied in the direction of electrical connection of printed components, printed circuits connected with non-printed electrical components, printed circuit components, etc., can solve problems such as device welding offset, reduce workload, realize Resource migration and sharing, solving the effect of performance degradation

Pending Publication Date: 2020-06-12
HUNAN CSR TIMES ELECTRIC VEHICLE
View PDF4 Cites 0 Cited by
  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0003] The invention provides a packaging structure and design method for PCB heat dissipation and anti-soldering deviation, w

Method used

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
View more

Image

Smart Image Click on the blue labels to locate them in the text.
Viewing Examples
Smart Image
  • Heat dissipation and welding offset prevention packaging structure of PCB and design method of heat dissipation and welding offset prevention packaging structure
  • Heat dissipation and welding offset prevention packaging structure of PCB and design method of heat dissipation and welding offset prevention packaging structure
  • Heat dissipation and welding offset prevention packaging structure of PCB and design method of heat dissipation and welding offset prevention packaging structure

Examples

Experimental program
Comparison scheme
Effect test

Example Embodiment

[0042] Example 1:

[0043] This embodiment takes the SOT-404 package as an example to illustrate the design method of the package structure of the heat dissipation of the PCB and the anti-soldering offset of the present invention, including the following steps:

[0044] S1: Conventional package design: Create a new SOT-404 package using the conventional package design method.

[0045] S2: Heat dissipation pad design: see figure 2 , image 3 and Figure 4 , select the "Top Layer" layer, and evenly place 5×5 circular pads with an aperture of 0.3mm in an array on the large heat dissipation pad of the SOT-404 package, as the heat dissipation hole of the device, and make a "plug" during PCB processing Hole" requirements to prevent solder paste from leaking to the bottom layer. Among them, the arrangement of cooling holes "N×M" can be determined according to the specific size of the heat dissipation pad. The spacing L1 between the holes and the distance L2 between the holes and...

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
Login to view more

PUM

PropertyMeasurementUnit
Apertureaaaaaaaaaa
Hole spacingaaaaaaaaaa
Side lengthaaaaaaaaaa
Login to view more

Abstract

The invention discloses a heat dissipation and welding offset prevention packaging structure of aPCB and a design method of the heat dissipation and welding offset prevention packaging structure, andthe method comprises the steps: placing an element package on a PCB during design; selecting a top wiring layer, placing a plurality of circular bonding pads arranged at intervals on the bonding padsof the element package, and marking the bonding pads as plug hole processing; and selecting a top solder mask layer, placing a plurality of isolation solder mask regions arranged at intervals on the plurality of circular bonding pads arranged at intervals, and enabling each isolation solder mask region to coincide with the center of the corresponding circular bonding pad and to be larger than thecorresponding circular bonding pad. Based on the improvement of the SMD heat dissipation capability and the elimination of welding offset, the SMD bonding pad is manufactured into an element package from the design source, and the heat dissipation and welding offset prevention effects are effectively realized in a mode of heat dissipation opening and solder mask isolation at the same time.

Description

technical field [0001] The invention relates to the field of PCBs, in particular to a PCB heat dissipation and packaging structure for preventing welding offset and a design method thereof. Background technique [0002] With the increasingly wide application of electronic products in all walks of life, the requirements for high integration and high reliability have become more and more prominent, so the requirements for components, PCB design and PCBA manufacturing technology are also getting higher and higher, especially is the design of the PCB. Taking the MOS tube in the SOT-404 package as an example, in addition to ensuring the basic electrical performance of the device itself, heat dissipation is also an important design point that cannot be ignored. In addition, due to the high heat dissipation requirements of this type of device, the pad area is large, and the flow of large-area solder paste during reflow soldering is likely to cause device deviation, which affects t...

Claims

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
Login to view more

Application Information

Patent Timeline
no application Login to view more
IPC IPC(8): H05K1/11H05K1/18
CPCH05K1/116H05K1/185H05K2201/09409H05K2201/2036
Inventor 肖洁谢佳申冬海
Owner HUNAN CSR TIMES ELECTRIC VEHICLE
Who we serve
  • R&D Engineer
  • R&D Manager
  • IP Professional
Why Eureka
  • Industry Leading Data Capabilities
  • Powerful AI technology
  • Patent DNA Extraction
Social media
Try Eureka
PatSnap group products

Browse by: Latest US Patents, China's latest patents, Technical Efficacy Thesaurus, Application Domain, Technology Topic.

© 2024 PatSnap. All rights reserved.Legal|Privacy policy|Modern Slavery Act Transparency Statement|Sitemap