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Radiator with built-in integrated supporting structure and preparation method of radiator

A technology for supporting structures and radiators, applied in manufacturing tools, welding equipment, metal processing equipment, etc., can solve the problems of poor flatness, manual placement of copper columns, and high labor costs, saving processes and improving cooling effects. , good heat dissipation effect

Pending Publication Date: 2020-06-12
DONGGUAN ZHENGKANG ELECTRONICS
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0005] Existing VC radiators have the following problems: the existing structure requires a large number of copper pillars, and the cost is high; the copper pillars need to be placed manually, the labor cost is high, and the production efficiency is extremely low. In the process of operation and handling, it is easy to cause the copper column to fall, and finally cause poor flatness.

Method used

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  • Radiator with built-in integrated supporting structure and preparation method of radiator
  • Radiator with built-in integrated supporting structure and preparation method of radiator
  • Radiator with built-in integrated supporting structure and preparation method of radiator

Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1

[0041] see Figure 1-10 As shown, a heat sink with a built-in integrated support structure includes a heat dissipation substrate 1. The heat dissipation substrate 1 is a VC structure. The heat dissipation substrate 1 includes a base and an upper plate. Edge sealing is carried out by means of material welding. The base 11 is provided with a cavity, and a supporting joint is arranged in the cavity. A circle of welding surface 112 is arranged outside the cavity, and a circle of solder is placed on the welding surface 112. The upper plate 12 is covered on the welding surface and closes the opening, and the base 11 and the upper plate 12 are assembled together for solder welding. When the base 11 and the upper plate 12 are heated to a temperature slightly higher than the melting point of the solder, The solder melts and is sucked and filled between the welding surface and the upper plate by capillary action, and the liquid solder diffuses and dissolves with the welding surface and ...

Embodiment 2

[0046] This embodiment is a modification of Embodiment 1, and the difference is that: the upper plate 12 is distributed with a circle of solder holes 121 on the edge corresponding to the position of the welding surface, and the solder holes 121 are used for injecting solder.

[0047] There are usually a large number of tiny cavities or cracks distributed on the welding surface (that is, the welding surface is uneven). When the upper plate is pressed to cover the opening of the base, the upper plate is pressed against the welding surface, which will seriously deform, twist or even break the solder on the welding surface , resulting in uneven and discontinuous structure of the brazing seam and large void area, which will affect the vacuum degree of the heat dissipation substrate, and may even overflow into the concave cavity of the base, and through the setting of the solder hole, the solder point is in the solder hole, Only the part of the injected brazing material in contact wi...

Embodiment 3

[0050] This embodiment is a modification of Embodiments 1 and 2. The change is that this embodiment is applied to a 3D heat sink, and the heat is conducted upwards through heat pipes to accelerate heat dissipation. Several heat pipes are provided on the heat dissipation substrate. , the heat pipe is provided with a set of fins, the heat pipe is a hollow tube with an opening at one end, the upper surface of the upper plate 12 is provided with a suction pipe 122 corresponding to the heat pipe, and the suction pipe 122 It includes a pre-punched hole and a flange integrated with the pre-punched hole. The flange is protruding relative to the upper surface of the upper plate. body through, and the outer wall surface of the opening end is connected to the inner wall surface of the flange in a planar manner. Changing the usual "line-surface" contact to "surface-surface" contact makes up for the shortcomings of weak welding between the heat pipe and the upper plate, and easy cracks aft...

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Abstract

The invention relates to a radiator with a built-in integrated supporting structure. The radiator comprises a heat dissipation substrate, the heat dissipation substrate comprises a base and an upper plate, wherein the base is provided with a concave cavity with an upward opening; the upper plate is used for covering the base and sealing the opening; a vacuum cavity is formed between the upper plate and the base; a liquid heat transfer medium is accommodated in the vacuum cavity; the liquid heat transfer medium is condensed to dissipate heat after being gasified; a plurality of bulges are arranged on the upper plate in the direction perpendicular to the surface of the upper plate and towards the vacuum cavity; according to the invention, the internal support structure of the heat dissipation substrate is optimized, and the plurality of three-stage bulges are integrally punched and formed on the upper plate, so that the process is saved, the cost is saved, the production efficiency is improved, the internal support area of the heat dissipation substrate is increased, the stability of the internal structure is enhanced, and the planeness of the heat dissipation substrate is maintained.

Description

technical field [0001] The invention relates to the technical field of radiators, in particular to a radiator with a built-in integrated support structure. Background technique [0002] With the rapid development of electronic equipment, the operating ability of electronic equipment is getting stronger and stronger, and the heat generated by the operation is increasing. The vapor chamber (VC for short) is used as a heat sink in high-power or highly integrated electronic products The device is widely used. When used properly, it can be simply understood as a component with a very high thermal conductivity. Vapor chambers have the following advantages: 1. Low space requirements, 2. Large contact area, 3. Fast thermal response. These features can be applied to heat sinks to reduce thermal spreading resistance and hot spots. [0003] The application of VC is divided into 2D VC radiator and 3D VC radiator. The 2D VC radiator is a plate radiator, which realizes the heat conduct...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): H05K7/20B23K28/02B23K31/02
CPCH05K7/20336H05K7/2039B23K28/02B23K31/02
Inventor 赖耀惠徐海长李龙荣
Owner DONGGUAN ZHENGKANG ELECTRONICS
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