Image sensor module and method for forming the same
An image sensor and module technology, applied in the field of image sensors, can solve problems such as support structure design and size limitations, image defects, and easy contamination of the photosensitive area
Active Publication Date: 2020-06-16
NINGBO SEMICON INT CORP
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Problems solved by technology
[0003] However, during packaging, such a manufacturing process exposes the image sensor on the PCB directly to the surrounding environment, and its photosensitive area is easily contaminated, causing image defects
And after the image sensor is attached to the PCB, the bracket and the infrared filter on the bracket may be bonded to the image sensor
This further restricts the structural design and size of the stent
Method used
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[0014] Reference will now be made in detail to the exemplary embodiments of the present disclosure, which are illustrated in the accompanying drawings. Wherever possible, the same reference numbers in different drawings indicate the same or like parts.
[0015] The invention provides an image sensor module and a forming method thereof. For example, attach a plurality of first chips on the carrier wafer. And forming a permanent bonding layer on each first chip. The second chip is bonded to each optical filter through a permanent bonding layer in the middle so as to form multiple packaging structures on the carrier wafer. The permanent bonding layer includes at least one patterned bonding layer or a transparent bonding layer. In some embodiments, the first chip is one of an optical filter and an image sensor. The second chip is the other of the filter and the image sensor. The image sensor in each packaging structure has a photosensitive area facing the filter.
[0016] In...
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Abstract
An image sensor module and method for forming the same are provided. Aplurality of first chips is attached to a carrier wafer. A permanent bonding layer is formed on each of the plurality of first chips. The permanent bonding layer includes at least one of a patterned bonding layer and a transparent bonding layer. A second chip is bonded with each of the plurality of transparent filters via the permanent bonding layer there-between to form a plurality of package structures on the carrier wafer. The first chip is one of a transparent filter and an image sensor. The second chip is the other of the transparent filter and the image sensor. The image senor has a photosensitive region facing the transparent filter in each package structure.
Description
technical field [0001] Embodiments of the present invention relate to the field of image sensors, and in particular to an image sensor module and a forming method thereof. Background technique [0002] Camera modules are widely used in various mobile terminals, such as mobile phones, personal digital assistants, and notebook computers. The formation of the traditional camera module is generally to attach the complementary metal oxide semiconductor (CMOS) image sensor chip on the printed circuit board (PCB), and then use a bracket to install the infrared filter, and then glue the bracket And the infrared filter is bonded with the image sensor. Finally install the motor and lens on the bracket. [0003] However, during packaging, such a manufacturing process directly exposes the image sensor on the PCB to the surrounding environment, and its photosensitive area is easily contaminated, resulting in image defects. And after the image sensor is attached to the PCB, the bracket...
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IPC IPC(8): H04N5/225H04N5/374H04N5/372G02B5/20H01L21/02H01L23/28H04N25/00
CPCH01L27/1462H01L27/14625H01L27/14618H01L27/14687H04N23/55H04N23/54H01L27/14636H05K2201/10151H01L27/14607H05K1/18H01L27/14632
Inventor 刘孟彬
Owner NINGBO SEMICON INT CORP