Chip cutting forming method and wafer

Abstract

The invention relates to a chip cutting forming method and a wafer. The chip cutting forming method comprises the following steps that an array substrate is provided and comprises a bottom plate, guide grooves distributed in the bottom plate and a plurality of chip units with hole channels, the guide groove communicates with the hole channels of the chip units, the bottom plate is provided with abottom face spaced from the guide groove and a peripheral face surrounding the bottom face, the guide groove penetrates through the peripheral face and forms an opening and bonds a cover plate on thebottom plate to form a to-be-perfused body together, a filling material in a liquid state is injected into the to-be-filled body from the opening of the guide groove, so that the filling material at least fills the pore channels of the chip units and is cured to form a wafer, and the wafer is cut to form a plurality of cutting bodies, and the filling material of each cutting body is removed to form the chip with the pore channels. According to the chip cutting and forming method and the wafer provided by the embodiment of the invention, the cutting and forming requirements of the chip can be met, chippings can be prevented from entering the pore channels of the chip, and the performance of the chip is ensured.

Description

technical field [0001] The invention relates to the technical field of chips, in particular to a method for cutting and forming chips and a wafer. Background technique [0002] Chips such as microfluidic chips have been widely used in the fields of life sciences, medicine, food and environmental hygiene inspections due to their small size, low cost, portability, fast analysis speed, and fewer samples required for analysis. [0003] Among them, since the production process of silicon-based microfluidic chips is similar to that of integrated circuits, it is easy to realize large-scale mass production of microfluidic chips with mature integrated circuit production processes, and the production efficiency is high, but there are also corresponding disadvantages, mainly It shows that when the mass-produced chips are diced, the cutting blade is easy to cause chips to be generated on the wafer at a high speed. Debris, and because the pores of the chip are in an open state, it is in...

AI Technical Summary

Problems solved by technology

[0003] Among them, since the production process of silicon-based microfluidic chips is similar to that of integrated circuits, it is easy to realize large-scale mass production of microfluidic chips with mature integrated circuit production processes, and the production efficiency is high, but there are also corresponding disadvantages, mainly It shows that when the mass-produced chips are diced, the cutting blade is easy to cause chips to be generated on the wafer at a high speed. Debris, and because the pores of the chip are in an open state, it is inevitable that the coolant will enter the pores of the microfluidic chip with debris, affecting the performance of the chip

Images