Chip cutting forming method and wafer
A molding method and chip technology, applied in chemical instruments and methods, laboratory containers, and techniques for producing decorative surface effects, etc., can solve the problems of wafer chipping, affecting chip performance, etc., and avoid damage , good performance, guarantee the effect of connectivity
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[0046] Features and exemplary embodiments of various aspects of the invention will be described in detail below. In the following detailed description, numerous specific details are set forth in order to provide a thorough understanding of the present invention. It will be apparent, however, to one skilled in the art that the present invention may be practiced without some of these specific details. The following description of the embodiments is only to provide a better understanding of the present invention by showing examples of the present invention. In the drawings and the following description, at least some well-known structures and techniques have not been shown in order to avoid unnecessarily obscuring the present invention; and, for clarity, the dimensions of some structures may have been exaggerated. Furthermore, the features, structures, or characteristics described hereinafter may be combined in any suitable manner in one or more embodiments.
[0047] The orient...
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