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Test piece surface principal stress testing device and method

A test method and technology of test device, which are applied in the direction of measuring device, force/torque/work measuring instrument, measuring force, etc., can solve the problems of complicated test and calculation process and inability to measure the whole field data.

Pending Publication Date: 2020-06-19
TIANJIN CHENGJIAN UNIV
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

The disadvantage of the first three methods above is that the whole field data cannot be measured
The stress separation method of one normal shot and one oblique shot of the patch can measure the full-field data, but the testing and calculation process is very complicated

Method used

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  • Test piece surface principal stress testing device and method
  • Test piece surface principal stress testing device and method
  • Test piece surface principal stress testing device and method

Examples

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Embodiment Construction

[0020] In order to better understand the purpose, structure and function of the present invention, a device and method for testing the surface principal stress of a test piece of the present invention will be described in further detail below in conjunction with the accompanying drawings.

[0021] like Figure 1a to Figure 2b As shown, it is shown as a test piece surface principal stress testing device and method of the present invention, the principal stress test is carried out by the photoelastic patch method and the digital image correlation method, the testing device includes a photoelastic patch, a member to be tested and Assemblies, wherein the photoelastic patch in the present invention is pasted on the component to be tested, and the patch material is made by using epoxy resin with low viscosity and room temperature curing agent, and adding an appropriate amount of diluent. The photoelastic patch is pasted on the surface of the component to be tested with an adhesive. ...

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PUM

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Abstract

The invention discloses a test piece surface principal stress testing device and method, and the device comprises a photoelastic patch which is pasted on a tested member; and a measurement assembly, which is arranged on one side of the tested member bonded with the photoelastic patch, wherein the measurement assembly comprises a light source, a color filter, a polarizer, a quarter-wave plate, a polarization analyzer and a CCD which are detachably fixed on a platform, the isodyne line stripe series and the strain value of the surface of the tested member are measured by moving the positions ofpart of devices in the measurement assembly, and the main stress of the surface of the tested member is obtained. According to the invention, a full-field main stress value of the surface of the tested member can be tested, and the stress distribution of the surface of the tested member can be displayed more visually in a photoelastic stripe form.

Description

technical field [0001] The invention relates to an optical stress measurement system, in particular to a test piece surface principal stress test device and method. Background technique [0002] In engineering practice, many dangerous points on stressed components are in a complex stress state, and the damage of materials at this time is related to the three principal stresses. The principal stress can be combined innumerably to study the ultimate stress value when it reaches a dangerous state. Based on long-term practice and a large number of test results, people put forward different hypotheses about the cause of material failure, and these hypotheses are usually called strength theories. [0003] The photoelastic patch method is to paste a photoelastic patch with high strain optical sensitivity on the surface of the measured component, and obtain the contour line interference fringe series produced by the patch with the deformation of the measured component surface. An ...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): G01L1/24G01L5/00
CPCG01L1/241G01L5/0047
Inventor 尚伟王金芝刘爽邵蕊李军龙
Owner TIANJIN CHENGJIAN UNIV
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