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Circuit, device and method for testability design of many-core computing chip

A technology for computing chips and circuits, applied in the field of chip testing, can solve problems such as current limitation, slow testing speed, and no patent works, and achieve the effect of improving overall energy efficiency, ensuring timeliness, and saving chip area costs

Active Publication Date: 2022-02-25
深圳芯行科技有限公司
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0004] At present, the commonly used testability design methods include scan chain (Scan Chain) test, software test, etc., but the advantage of scan chain (Scan Chain) technology is that the test speed is fast and the coverage is complete, but it needs to introduce additional circuit area and power consumption. At the same time, problems such as current limitation and heat generation are faced during testing, especially on high-performance many-core computing chips; software testing is a low-cost method, but its disadvantage is that the test speed is slow and the timeliness is poor
[0005] Although there is a built-in self-test (BIST, Build-In-Self-Test) circuit in the prior art, it still has no corresponding real-speed test and automatic classification of chip performance. Related patent works in this area

Method used

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  • Circuit, device and method for testability design of many-core computing chip
  • Circuit, device and method for testability design of many-core computing chip
  • Circuit, device and method for testability design of many-core computing chip

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Embodiment Construction

[0041] In order to make the technical problems, technical solutions and advantages to be solved by the present invention clearer, the following will be described in detail in conjunction with the accompanying drawings and specific embodiments. The following embodiments are used to illustrate the present invention, but not to limit the scope of the present invention.

[0042] refer to figure 1 As shown, the embodiment of the present invention provides a circuit for testability design of many-core computing chips, including a built-in self-test circuit 400, multiple computing cores and at least one computing core data input path selector 405;

[0043]The built-in self-test circuit is used for the selection of each computing core test data, test process control and external transmission, wherein the test data is pre-stored in the many-core computing chip or comes from external input, including test case sets, test case The number of test cases included in the set can be one or mo...

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PUM

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Abstract

The invention discloses a circuit, device and method for the testability design of many-core computing chips. The many-core computing chips have preset classification marks and include a plurality of computing cores. Each computing core is assigned a different core ID; when testing, control the test process of each computing core, including the selection of test data and test process control; and send the test data to the computing core, test each computing core according to the test data, and according to the test results , record the number of failed computing cores and the corresponding core IDs; finally modify the classification marks of the many-core computing chips according to the test results and repair them; the effect is: by detecting the computing results of each computing core, it can be judged that the computing core is functioning correctly In addition, the test process is automatically completed by the hardware, which ensures the timeliness of the test.

Description

technical field [0001] The invention relates to the technical field of chip testing, in particular to a circuit, device and method for testability design of many-core computing chips. Background technique [0002] With the rise of popular fields such as blockchain and AI, its huge computing demand has driven a wave of research on multi-core computing chips, such as GPUs, AI chips, digital cryptocurrency mining chips, and so on. These chips have a common feature, they all achieve the purpose of high computing power on a single chip by stacking many identical computing cores. [0003] The chip manufacturing process is usually not ideal. Due to various factors, some manufacturing defects or deviations will be introduced. In the chip design stage, it is necessary to provide certain testing methods, that is, testability design, so that testing and screening can be performed after the chip is produced. . With the evolution of integrated circuit technology, the number of computin...

Claims

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Application Information

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Patent Type & Authority Patents(China)
IPC IPC(8): G01R31/317G01R31/3187
CPCG01R31/31724G01R31/31704G01R31/3187
Inventor 杨全校万晓船
Owner 深圳芯行科技有限公司