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Semiconductor laser chip mounting device and method

A chip device and laser technology, applied in semiconductor lasers, lasers, laser parts and other directions, can solve the problems of semiconductor lasers and heat sink solder voids, and achieve the effect of improving chip efficiency

Active Publication Date: 2020-06-19
江西德瑞光电技术有限责任公司
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0004] Based on this, the purpose of the present invention is to provide a semiconductor laser chip placement device and method to solve the technical problem of solder voids between the semiconductor laser and the heat sink in the prior art

Method used

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  • Semiconductor laser chip mounting device and method
  • Semiconductor laser chip mounting device and method
  • Semiconductor laser chip mounting device and method

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Experimental program
Comparison scheme
Effect test

Embodiment 1

[0034] see figure 1 with figure 2 , shows the semiconductor laser chip placement device in the first embodiment of the present invention, including a patch container 10 with a sealed chamber 11, a heating patch seat 20 arranged at the bottom of the sealed chamber 11, and the sealed chamber 11 The connected atmosphere control mechanism 30, and the manipulating mechanism 40 that is installed on the patch container 10 for patching operations, wherein:

[0035] The patch container 10 is a box-like structure as a whole, and the sealed space enclosed inside it constitutes a sealed chamber 11 . In order to facilitate putting semiconductor lasers and heat sinks into the sealed chamber 11, and to take out the finished product (the welded body of semiconductor lasers and heat sinks) from the sealed chamber 11, the patch container 10 also has a pick-and-place window. 12. Specifically, the pick-and-place window 12 can be opened on the top and / or the side wall of the patch container 10....

Embodiment 2

[0047] see Figure 6 , described as the semiconductor laser chip placement device in the second embodiment of the present invention, the difference between the semiconductor laser chip placement device in the present embodiment and the semiconductor laser chip placement device in the first embodiment is:

[0048] An air pressure measuring device 33 (such as a pressure gauge) for measuring the pressure in the sealed chamber 11 is arranged on the exhaust pipe 312 and / or the inflation pipe 322, so that the pressure value measured by the air pressure measuring device 33 can directly know the air pressure of the sealed chamber. 11 Whether it is evacuated to further improve the patch efficiency. Such as Figure 6 As shown, in the present embodiment, the air pressure measuring device 33 is only arranged on the air extraction pipe 312, but the present invention is not limited thereto, and in other embodiments, all the air pressure measurement devices 33 can be arranged on the air ext...

Embodiment 3

[0051] see Figure 7 , described as the semiconductor laser chip placement device in the third embodiment of the present invention, the difference between the semiconductor laser chip placement device in the present embodiment and the semiconductor laser chip placement device in the first embodiment is:

[0052] The semiconductor laser patch device also includes a microscope 50 opposite to the transparent part, a CCD camera 60 connected to the microscope 50, and a display 70 (such as an LCD display) connected to the CCD camera 60, and the CCD camera 60 is arranged coaxially with the microscope 50 , the CCD camera 60 cooperates with the microscope 50, which can enlarge the placement process and capture the picture, so as to finally enlarge and display the placement process on the display 70, thereby helping the operator to perform precise placement, ensuring placement accuracy and avoiding The generation of packaging voids completes high-quality SMT packaging.

[0053] It shou...

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PUM

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Abstract

The invention provides a semiconductor laser chip mounting device and method. The device comprises a patch container with a sealed chamber, a heating patch seat arranged at the bottom of the sealed chamber, an atmosphere regulation and control mechanism connected with the sealed chamber, and a control mechanism arranged on the patch container in a penetrating manner. The atmosphere regulation andcontrol mechanism comprises an air exhaust assembly for vacuumizing and an air inflation assembly for inflating inert gas; the control mechanism is sealed and movably connected with the patch container through a flexible element; an adsorption part is arranged at one end of the control mechanism, and the adsorption part is arranged in the sealed chamber. According to the invention, the sealed chamber is arranged; the control mechanism capable of externally carrying out chip mounting operation on the sealed chamber is arranged; the air exhaust assembly used for creating a vacuum chip mounting environment is arranged to conveniently and rapidly achieve vacuum chip mounting; solder cavities are prevented from being generated between a semiconductor laser and a heat sink; and in addition, theair inflation assembly used for inflating inert gas into the sealed chamber is further arranged, so that rapid cooling can be achieved after chip mounting, and the chip mounting efficiency is improved.

Description

technical field [0001] The invention relates to the technical field of semiconductor lasers, in particular to a semiconductor laser patch device and method. Background technique [0002] Semiconductor lasers (chips) are widely used in communication, processing, medicine, scientific research, sensing and other fields. They have many advantages such as small size, high efficiency, light weight, long life, and good process compatibility. The earth has promoted the development of information, measurement, medical treatment, entertainment and other related industries. [0003] Due to the particularity of the application requirements of semiconductor lasers, most semiconductor lasers must go through the SMD packaging process before they can be put into downstream application production. Due to the limitations of packaging technology, the most serious problem faced in the semiconductor laser SMT process is the chip. Solder voids between heat sinks. Because there is often compress...

Claims

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Application Information

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IPC IPC(8): H01S5/022
CPCH01S5/02355H01S5/0237
Inventor 蒋锴万怡富徐化勇高阳舒凯李春勇
Owner 江西德瑞光电技术有限责任公司