Aluminum substrate and circuit board and server having same

Abstract

The invention discloses an aluminum substrate, a circuit board and a server thereof. The aluminum substrate comprises: a substrate, a cooling liquid channel is constructed in the substrate; a thermally conductive insulating layer, and the thermally conductive insulating layer is laid on the substrate. On: the circuit layer, the circuit layer is laid on the heat-conducting insulating layer to connect the electronic components. The aluminum substrate according to the invention adopts a liquid-cooled heat dissipation method, which has the advantages of high heat dissipation efficiency, small heat dissipation thermal resistance, reliable circuit performance, and convenience for later maintenance.

Description

technical field [0001] The invention relates to the field of circuit boards, in particular to an aluminum substrate, a circuit board and a server with the same. Background technique [0002] Aluminum substrates are usually used in occasions with severe heat generation and high heat dissipation requirements for component circuit boards. Aluminum substrates mainly include aluminum plates, thermally conductive insulating layers and copper clad layers. On the layer, the copper clad layer processes the circuit to connect the electronic components. [0003] The heat dissipation methods of the aluminum substrate in the related art are generally divided into air cooling and water cooling, wherein the air cooling method has low heat dissipation efficiency and cannot meet the heat dissipation requirements of high power. Moreover, regardless of the air-cooled or water-cooled heat dissipation method, the heat sink is attached to the aluminum plate and / or electronic components as a sepa...

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Problems solved by technology

[0003] The heat dissipation methods of aluminum substrates in the related art are usually divided into air cooling and water cooling, and the heat dissipation efficiency of the air cooling method is low, which cannot meet the heat dissipation requirements of high power

Moreover, regardless of the air-cooled or water-cooled heat dissipation method, the heat sink is attached to the aluminum plate and / or electronic components as a separate component. Due to the existence of manufacturing and installation errors, there will inevitably be problems with poor bonding, resulting in Increased thermal resistance is not conducive to heat dissipation, and the heat of the wires on the circuit cannot be dissipated quickly, which affects circuit performance

In addition, if electronic components are mounted with a heat sink, when a fault occurs, the heat sink needs to be removed to test the circuit, which is not conducive to later maintenance.

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