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Conductive adhesive and application thereof

A technology of conductive adhesive and conductive ball, applied in the field of conductive adhesive, can solve the problems of poor fixation, inability to connect electronic components, etc., to achieve the effect of firm electrical connection, realization of product characteristics, and simplified formula process

Pending Publication Date: 2020-06-26
苏州鑫导电子科技有限公司
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  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

This structure cannot connect the electronic components very well, and the fixation is poor

Method used

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  • Conductive adhesive and application thereof
  • Conductive adhesive and application thereof
  • Conductive adhesive and application thereof

Examples

Experimental program
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Embodiment Construction

[0035] Preferred embodiments of the present invention will be described in detail below in conjunction with the accompanying drawings.

[0036] In order to achieve the purpose of the present invention, in some embodiments of a conductive adhesive and its application, such as figure 1 As shown, a conductive adhesive includes: an adhesive layer 1 , a plurality of conductive balls 2 distributed in the adhesive layer 1 , and a plurality of low-melting alloy balls / powders 3 scattered in the adhesive layer 1 .

[0037] The invention discloses a conductive adhesive, in which a plurality of low melting point alloy balls / powders are scattered and arranged in the adhesive layer 1, when electronic components are connected to each other, the low melting point alloy balls / powders 3 melt at high temperature, so that the electronic components are electrically connected Stronger, no misalignment. At the same time, the one-time mixing method of conductive ball 2, low melting point alloy ball / ...

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Abstract

The invention discloses a conductive adhesive and application thereof. The conductive adhesive comprises an adhesive layer, a plurality of conductive balls distributed in the adhesive layer and a plurality of low-melting-point alloy balls / powder distributed in the adhesive layer in a scattered mode. According to the invention, the plurality of low-melting-point alloy balls / powder is dispersedly arranged in the adhesive layer, and when electronic components are connected with each other, the low-melting-point alloy balls / powder is melted at a high temperature, so that the electric connection ofthe electronic components is firmer, and the electronic components are not deviated. Meanwhile, the conductive ball, the low-melting-point alloy ball / powder and the colloid are mixed at a time, the formula process is simplified, the flexibility of specification performance adjustment is improved, and the product characteristics are realized.

Description

technical field [0001] The invention specifically relates to a conductive adhesive and its application. Background technique [0002] In the electronics industry, anisotropic conductive adhesives are widely used when mounting electronic components such as IC chips on substrates. With the high density of wiring required in small electronic devices such as mobile phones and notebooks, the existing anisotropic conductive adhesives are gradually unable to meet the demand. [0003] The existing patent TW531868B discloses a welded anisotropic conductive adhesive, which includes: an adhesive material and a plurality of conductive particles arranged in the adhesive material, each configured conductive particle includes a conductive ball, a welding layer and an auxiliary flux layer. The welding layer is arranged on the surface of the welding layer to cover the sphere, and the flux layer is arranged on the welding layer. This structure cannot connect the electronic components very ...

Claims

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Application Information

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IPC IPC(8): C09J9/02C09J7/25B32B3/08B32B7/12B32B27/06B32B27/36B32B33/00G02F1/1345
CPCC09J9/02C09J7/255G02F1/13452B32B27/06B32B27/36B32B7/12B32B3/08B32B33/00C09J2203/326C09J2467/006
Inventor 吴曾财
Owner 苏州鑫导电子科技有限公司
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