Retaining ring and carrier head for chemical mechanical polishing

Abstract

The invention discloses a retaining ring and a bearing head for chemical mechanical polishing. The retaining ring is composed of an annular part, the annular part is composed of a metal part and a non-metal part, and the non-metal part is formed on the peripheral side of the metal part in a molding mode; the annular part comprises a top face, a bottom face, an outer side face and an inner side face, the top face is fixedly connected with the bearing head, the bottom face abuts against the polishing surface, the outer side face is arranged on the outer side of the annular part and connected with the top face and the bottom face, and the inner side face is arranged on the inner side of the annular part and connected with the top face and the bottom face; the bottom face is provided with a liquid supply groove communicating with the inner side face and the outer side face; and a threaded hole is formed in the top face and located vertically above the liquid supply groove.

Description

technical field [0001] The invention belongs to the technical field of chemical mechanical polishing, and in particular relates to a retaining ring and a bearing head for chemical mechanical polishing. Background technique [0002] Chemical Mechanical Planarization (CMP) is a global planarization ultra-precision surface processing technology. In this polishing method, the substrate is usually attracted to the lower part of the carrier head, and the bottom surface of the substrate with the deposited layer is in contact with the rotating polishing pad. The carrier head rotates in the same direction as the polishing pad under the drive of the driving component and gives the substrate a downward load. ; At the same time, the polishing liquid is supplied between the polishing pad and the substrate, and the material removal of the substrate is realized under the joint action of chemistry and machinery. [0003] The lower part of the carrying head is provided with a retaining ring...

AI Technical Summary

Problems solved by technology

In general, in order to pursue the flatness of the bottom surface of the retaining ring, it is necessary to break in when using a new retaining ring so that the flatness of the bottom surface of the new retaining ring can reach the preset requirements. In order to shorten the time of breaking in, such as CN1910012B and other technologies set the bottom surface of the retaining ring as a regular concave-convex structure, but generally require complex tooling combinations such as those disclosed in CN105563306B to produce this type of micro-concave-convex structure

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