Looking for breakthrough ideas for innovation challenges? Try Patsnap Eureka!

A space device based on a smartphone motherboard

A technology for smart phones and space equipment, applied in the fields of aerospace and aviation systems, can solve problems such as the difficulty of space application of smart phones, and achieve the effects of extending on-orbit operation time, enhancing stability, and reducing power consumption

Active Publication Date: 2021-09-28
XIAN MICROELECTRONICS TECH INST
View PDF7 Cites 0 Cited by
  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0005] The purpose of the present invention is to overcome the above-mentioned shortcoming that smart phones are difficult to use in space in the prior art, and provide a space device based on a smart phone motherboard

Method used

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
View more

Image

Smart Image Click on the blue labels to locate them in the text.
Viewing Examples
Smart Image
  • A space device based on a smartphone motherboard
  • A space device based on a smartphone motherboard
  • A space device based on a smartphone motherboard

Examples

Experimental program
Comparison scheme
Effect test

Embodiment Construction

[0032] In order to enable those skilled in the art to better understand the solutions of the present invention, the following will clearly and completely describe the technical solutions in the embodiments of the present invention in conjunction with the drawings in the embodiments of the present invention. Obviously, the described embodiments are only It is an embodiment of a part of the present invention, but not all embodiments. Based on the embodiments of the present invention, all other embodiments obtained by persons of ordinary skill in the art without making creative efforts shall fall within the protection scope of the present invention.

[0033] It should be noted that the terms "first" and "second" in the description and claims of the present invention and the above drawings are used to distinguish similar objects, but not necessarily used to describe a specific sequence or sequence. It is to be understood that the data so used are interchangeable under appropriate ...

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
Login to View More

PUM

No PUM Login to View More

Abstract

The invention belongs to the technical field of aerospace and aviation systems, and discloses a space device based on a smart phone main board, including a smart phone main board and a reinforcement board, on which a USB interface expansion chip, an Ethernet conversion chip, a temperature sensor, a voltage and current Acquisition module, switch machine control interface, electronic load switch, power management module and MCU chip; one end of the USB interface expansion chip is connected to the USB interface, and the other end is provided with a USB debugging interface and a USB data interface connected to the Ethernet conversion chip, and the Ethernet conversion chip The LAN interface is set on the computer; one end of the temperature sensor, the switch control interface and the voltage and current acquisition module are connected to the MCU chip, and the other end is connected to the smartphone motherboard. The CAN interface is set on the MCU chip, and the power management module is connected to the battery interface and the MCU through the electronic load switch. The chip has simple implementation, strong computing and storage capabilities, small size, and short development cycle. It can be equipped with the Andriod operating system, which is convenient for third-party application software development.

Description

technical field [0001] The invention belongs to the technical field of aerospace and aviation systems, and relates to a space device based on a smart phone motherboard. Background technique [0002] With the development of aerospace and aviation industries, higher requirements are put forward for space equipment, requiring space equipment to have the characteristics of high-performance computing and large-capacity storage, and to develop in the direction of miniaturization and integration. Smartphones integrate current high-tech technologies, such as light, mechanics, electricity, chips, computer technology, hardware, software, camera and communication, etc. Using such a mature and ready-made high-tech research result as a space device can improve the on-orbit Information processing and storage capabilities reduce development costs and payload volume. [0003] Foreign countries have begun research on the space application of smartphones in 2009. NASA’s Ames Space Center suc...

Claims

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
Login to View More

Application Information

Patent Timeline
no application Login to View More
Patent Type & Authority Patents(China)
IPC IPC(8): G06F13/38H04M1/02
CPCH04M1/026H04M1/0277
Inventor 马荟刘曦葛坚定雷冰
Owner XIAN MICROELECTRONICS TECH INST
Who we serve
  • R&D Engineer
  • R&D Manager
  • IP Professional
Why Patsnap Eureka
  • Industry Leading Data Capabilities
  • Powerful AI technology
  • Patent DNA Extraction
Social media
Patsnap Eureka Blog
Learn More
PatSnap group products

Browse by: Latest US Patents, China's latest patents, Technical Efficacy Thesaurus, Application Domain, Technology Topic, Popular Technical Reports.

© 2024 PatSnap. All rights reserved.Legal|Privacy policy|Modern Slavery Act Transparency Statement|Sitemap|About US| Contact US: help@patsnap.com