Wafer Stripping Device

Abstract

The invention discloses a wafer stripping device, which is fixedly connected with the external equipment frame, including a stripping actuator integrally movably arranged on the external equipment frame, used to complete the wafer stripping operation, and integrally fixedly connected with the external equipment The transport actuator on the frame is used to complete the wafer transportation; the peeling actuator includes a wafer suction component and a wafer flipping component; under the cooperation of the wafer suction component and the wafer flipping component, the external The wafers carried on the wafer support mechanism are peeled off one by one and moved to the transfer actuator. The present invention completes the stripping and blanking of wafers in the wafer processing process by means of mechanization and automation, improves operation efficiency while meeting operation requirements, saves human resources, and reduces the burden of processing enterprises.

Description

technical field [0001] The invention relates to an automatic loading and unloading device, in particular to a wafer stripping device used in the wafer processing process, belonging to the technical field of industrial automation. Background technique [0002] Wafers, also known as silicon wafers, are products processed from silicon ingots and are used in many industries such as semiconductors, silicon carbide, sapphire, and solar photovoltaics. Due to the special structure of the wafer, millions of transistors can be etched on the wafer through a special processing technology. Therefore, the wafer has been widely used in the processing and manufacturing of integrated circuits at present. [0003] Specifically, in the process of processing, the wafer bar is glued together with the resin board by means of glue, and the equipment is cut with a wire to form wafers one by one. Subsequently, it needs to be soaked in hot water to soften the glue, so as to realize the separation of...

AI Technical Summary

Problems solved by technology

[0004] However, in the long-term actual operation, the technicians found that there are several significant defects in the manual removal of the wafer: first, in order to ensure the softening effect of the glue and speed up the separation of the wafer and the resin plate , the temperature of the water soaking the wafer needs to be kept above 70°C, so the operator faces a high risk of burns during manual operations

Secondly, also because the water temperature is too high, during manual operation, the operator needs to wear gloves to pick and place the wafer back and forth, which is very inconvenient to operate and affects work efficiency

In addition, the number of wafers on a whole wafer rod is about 400 pieces, and the number of wafers in a single pick-and-place process is about 50 pieces. It is necessary to ensure the separation of wafers during pick-and-place. Obviously, the labor intensity of the wafer stripping operation is very high, which seriously wastes the human resources in the processing enterprise and increases the labor cost.

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